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TPCP8604(TE85L)

更新时间: 2024-11-06 10:11:27
品牌 Logo 应用领域
东芝 - TOSHIBA /
页数 文件大小 规格书
5页 172K
描述
TRANSISTOR,BJT,NPN,400V V(BR)CEO,300MA I(C),TSOP

TPCP8604(TE85L) 技术参数

是否Rohs认证: 不符合生命周期:Active
包装说明:,Reach Compliance Code:unknown
风险等级:5.69最大集电极电流 (IC):0.3 A
配置:Single最小直流电流增益 (hFE):140
最高工作温度:150 °C极性/信道类型:NPN
最大功率耗散 (Abs):2.2 W子类别:Other Transistors
表面贴装:YESBase Number Matches:1

TPCP8604(TE85L) 数据手册

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TPCP8604  
TOSHIBA Transistor Silicon NPN Triple Diffused Mesa Type  
TPCP8604  
High-Voltage Switching Applications  
Unit: mm  
0.33±0.05  
High breakdown voltage: V  
= 400 V  
CEO  
M
A
0.05  
5
8
Absolute Maximum Ratings (Ta = 25°C)  
Characteristics  
Collector-base voltage  
Symbol  
Rating  
Unit  
0.475  
1
4
B
V
CBO  
V
CEO  
V
EBO  
400  
400  
7  
V
V
V
B
M
0.05  
0.65  
2.9±0.1  
Collector-emitter voltage  
Emitter-base voltage  
A
0.8±0.05  
DC (Note 1)  
I
0.3  
C
S
0.025  
+0.1  
0.28  
S
Collector current  
Base current  
A
A
0.17±0.02  
-0.11  
Pulse(Note 1)  
I
1  
CP  
+0.13  
I
0.25  
2.2  
B
1.12  
1.12  
-0.12  
t=10s  
DC  
Collector power  
dissipation  
+0.13  
-0.12  
P
(Note 2)  
W
C
1.1  
+0.1  
0.28  
Junction temperature  
T
j
150  
55 to 150  
°C  
°C  
-0.11  
1. NC  
5. NC  
Storage temperature range  
T
stg  
2. COLLECTOR  
3. COLLECTOR  
4. COLLECTOR  
6. EMITTER  
7. NC  
8. BASE  
Figure1. Circuit Configuration  
Figure2.Marking(Note 3)  
JEDEC  
JEITA  
8
7
6
5
8
7
6
5
TOSHIBA  
2-3V1D  
Type  
8604  
Weight: 0.05 g (typ.)  
Lot No.  
(Weekly code)  
1
2
3
4
1
2
3
4
Note 1 : Please use devices on condition that the junction temperature is below 150.  
Note 2 : Mounted on FR4 board( glass epoxy, 1.6mm thick, Cu area: 645mm2)  
Note 3 :on lower left of the marking indicates Pin 1.  
Weekly code: (three digits)  
Week of manufacture  
(01 for first week of year, continues up to 52 or 53)  
Year of manufacture  
(One low-order digits of calendar year)  
Note 4 : Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the  
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even  
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum  
ratings.  
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook  
(“Handling Precautions”/Derating Concept and Methods) and individual reliability data (i.e. reliability test  
report and estimated failure rate, etc).  
1
2007-06-07  

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