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TPCP8901 PDF预览

TPCP8901

更新时间: 2024-11-05 03:26:47
品牌 Logo 应用领域
东芝 - TOSHIBA 晶体小信号双极晶体管开关光电二极管PC
页数 文件大小 规格书
7页 253K
描述
TOSHIBA Transistor Silicon NPN / PNP Epitaxial Type (PCT Process)

TPCP8901 技术参数

是否无铅: 含铅是否Rohs认证: 符合
生命周期:Active包装说明:SMALL OUTLINE, R-PDSO-F8
针数:8Reach Compliance Code:unknown
风险等级:5.75Is Samacsys:N
最大集电极电流 (IC):1 A集电极-发射极最大电压:50 V
配置:SEPARATE, 2 ELEMENTS最小直流电流增益 (hFE):200
JESD-30 代码:R-PDSO-F8元件数量:2
端子数量:8最高工作温度:150 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:NPN AND PNP最大功率耗散 (Abs):1.48 W
认证状态:Not Qualified子类别:BIP General Purpose Small Signal
表面贴装:YES端子形式:FLAT
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

TPCP8901 数据手册

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TPCP8901  
TOSHIBA Transistor Silicon NPN / PNP Epitaxial Type (PCT Process)  
TPCP8901  
Portable Equipment Applications  
Unit: mm  
Switching Applications  
0.33±0.05  
A
M
0.05  
5
8
Small footprint due to small and thin package  
High DC current gain : PNP  
:NPN  
h
= 200 to 500 (I = 0.1 A)  
FE C  
h
= 400 to 1000 (I = 0.1 A)  
C
FE  
0.475  
1
4
B
B
M
0.05  
Low collector-emitter saturation : PNP  
: NPN  
V
= 0.20 V (max)  
0.65  
CE (sat)  
CE (sat)  
2.9±0.1  
A
V
= 0.17 V (max)  
0.8±0.05  
High-speed switching : PNP t = 70 ns (typ.)  
f
S
0.025  
: NPN t = 85 ns (typ.)  
f
+0.1  
S
0.28  
0.17±0.02  
-0.11  
+0.13  
-0.12  
1.12  
1.12  
Absolute Maximum Ratings (Ta = 25°C)  
+0.13  
-0.12  
Rating  
Characteristics  
Symbol  
Unit  
+0.1  
0.28  
PNP  
50  
50  
7  
NPN  
100  
50  
-0.11  
1.Emitter1  
5.Collector2  
6.Collector2  
7.Collector1  
8.Collector1  
2.Base1  
3.Emitter2  
4.Base2  
Collector-base voltage  
V
CBO  
V
CEO  
V
EBO  
V
V
V
Collector-emitter voltage  
Emitter-base voltage  
JEDEC  
JEITA  
7
DC (Note 1)  
I
0.8  
5.0  
1.0  
5.0  
C
Collector current  
A
TOSHIBA  
2-3V1C  
Pulse (Note 1 )  
I
CP  
Weight: 0.017 g (typ.)  
Base current  
I
100  
100  
mA  
B
Single-device  
operation  
1.48  
Collector power  
dissipation (t = 10s)  
P
P
(Note 2)  
(Note 2)  
W
W
C
C
Single-device  
value at dual  
operation  
0.80  
0.83  
Single-device  
operation  
Collector power  
dissipation (DC)  
Single-device  
value at dual  
operation  
0.48  
150  
Junction temperature  
T
j
°C  
°C  
Storage temperature range  
T
55 to 150  
stg  
Note 1: Please use devices on condition that the junction temperature is below 150.  
Icp=±5A (@ t100μs)  
Note 2: Mounted on FR4 board (glass epoxy, 1.6 mm thick, Cu area: 645 mm2)  
Note 3: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the  
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly  
even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute  
maximum ratings.  
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook  
(“Handling Precautions”/Derating Concept and Methods) and individual reliability data (i.e. reliability test  
report and estimated failure rate, etc).  
1
2006-11-13  

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