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Datasheet > TC55VCM416BSGN55
TC55VCM416BSGN55 PDF预览

TC55VCM416BSGN55

更新时间： 2024-11-08 19:05:03
品牌 Logo 应用领域
东芝 - TOSHIBA 静态存储器光电二极管内存集成电路
页数 文件大小 规格书
18页 232K
描述
IC 1M X 16 STANDARD SRAM, 70 ns, PDSO48, 12 X 14 MM, 0.50 MM PITCH, LEAD FREE, PLASTIC, TSOP1-48, Static RAM

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中文翻译

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TC55VCM416BSGN55 技术参数

生命周期：Obsolete零件包装代码：TSOP1
包装说明：TSOP1, TSSOP48,.55,20针数：48
Reach Compliance Code：unknownECCN代码：3A991.B.2.A
HTS代码：8542.32.00.41风险等级：5.84
最长访问时间：70 nsI/O 类型：COMMON
JESD-30 代码：R-PDSO-G48长度：12.4 mm
内存密度：16777216 bit内存集成电路类型：STANDARD SRAM
内存宽度：16功能数量：1
端子数量：48字数：1048576 words
字数代码：1000000工作模式：ASYNCHRONOUS
最高工作温度：85 °C最低工作温度：-40 °C
组织：1MX16输出特性：3-STATE
封装主体材料：PLASTIC/EPOXY封装代码：TSOP1
封装等效代码：TSSOP48,.55,20封装形状：RECTANGULAR
封装形式：SMALL OUTLINE, THIN PROFILE并行/串行：PARALLEL
电源：2.5/3.3 V认证状态：Not Qualified
座面最大高度：1.2 mm最小待机电流：1.5 V
子类别：SRAMs最大压摆率：0.02 mA
最大供电电压 (Vsup)：3.6 V最小供电电压 (Vsup)：2.3 V
标称供电电压 (Vsup)：3 V表面贴装：YES
技术：CMOS温度等级：INDUSTRIAL
端子形式：GULL WING端子节距：0.5 mm
端子位置：DUAL宽度：12 mm
Base Number Matches：1

TC55VCM416BSGN55 数据手册

 浏览型号TC55VCM416BSGN55的Datasheet PDF文件第2页浏览型号TC55VCM416BSGN55的Datasheet PDF文件第3页浏览型号TC55VCM416BSGN55的Datasheet PDF文件第4页浏览型号TC55VCM416BSGN55的Datasheet PDF文件第5页浏览型号TC55VCM416BSGN55的Datasheet PDF文件第6页浏览型号TC55VCM416BSGN55的Datasheet PDF文件第7页 
TC55VCM416BTGN, TC55VCM416BSGN, TC55VEM416BXGN55  
TC55YCM416BTGN, TC55YCM416BSGN, TC55YEM416BXGN70  
TOSHIBA MOS DIGITAL INTEGRATED CIRCUIT SILICON GATE CMOS  
Lead-Free  
1,048,576-WORD BY 16-BIT FULL CMOS STATIC RAM  
DESCRIPTION  
The TC55VCM416B, TC55VEM416B, TC55YCM416B and TC55YEM416B is a 16,777,216-bit static random  
access memory (SRAM) organized as 1,048,576 words by 16 bits. Fabricated using Toshiba's CMOS Silicon gate  
process technology, this device operates from a single 2.3 to 3.6 V/1.65 to 2.2 V power supply. Advanced circuit  
technology provides both high speed and low power at an operating current of 2 mA/MHz and a minimum cycle  
time of 55 ns. It is automatically placed in low-power mode at 0.7 μA standby current (at VDD = 3 V, Ta = 25°C,  
typical) when chip enable (CE1 ) is asserted high or (CE2) is asserted low. There are three control inputs. CE1  
and CE2 are used to select the device and for data retention control, and output enable (OE ) provides fast memory  
access. Data byte control pin ( LB , UB ) provides lower and upper byte access. This device is well suited to various  
microprocessor system applications where high speed, low power and battery backup are required. And, with a  
guaranteed operating extreme temperature range of −40° to 85°C, the TC55VCM416B, TC55VEM416B,  
TC55YCM416B and TC55YEM416B can be used in environments exhibiting extreme temperature conditions. The  
TC55VCM416BTGN/BSGN, TC55YCM416BTGN/BSGN is available in a plastic 48-pin thin-small-outline package  
(TSOP). The TC55VEM416BXGN, TC55YEM416BXGN is available in a plastic 48-ball BGA.  
FEATURES  
•
Low-power dissipation  
Operating: 6 mW/MHz (typical)  
Power down features usingCE1 and CE2  
Wide operating temperature range of −40° to 85°C  
Lead-Free  
•
•
•
Access time  
(MAX)  
Supply Current  
Operating  
Supply  
Voltage  
At Data  
Retention  
Part Number  
Package  
Supply  
Supply  
Voltage  
At  
At  
Voltage  
Operating Standby  
2.7~3.6 V  
2.3~3.6 V  
(MAX)  
20 mA  
(MAX)  
48-pin Plastic TSOP(I)  
(12×20mm) (0.5mm pin pitch)  
(Normal bent)  
TC55VCM416BTGN55  
TC55VCM416BSGN55  
TC55VEM416BXGN55  
55 ns  
55 ns  
55 ns  
70 ns  
70 ns  
70 ns  
48-pin Plastic TSOP(I)  
2.3~3.6 V (12×14mm) (0.5mm pin pitch)  
15 μA  
1.5~3.6 V  
(Normal bent)  
48-ball BGA  
(8×11mm) (0.75mm ball pitch)  
Access time  
(MAX)  
Supply Current  
Operating  
Supply  
Voltage  
At Data  
Retention  
Part Number  
Package  
Supply  
Supply  
Voltage  
At  
At  
Voltage  
Operating Standby  
1.8~2.2 V  
1.65~2.2 V  
(MAX)  
15 mA  
(MAX)  
48-pin Plastic TSOP(I)  
(12×20mm) (0.5mm pin pitch)  
(Normal bent)  
TC55YCM416BTGN70  
TC55YCM416BSGN70  
TC55YEM416BXGN70  
70 ns  
85 ns  
85 ns  
85 ns  
48-pin Plastic TSOP(I)  
1.65~2.2 V (12×14mm) (0.5mm pin pitch)  
15 μA  
1.0~2.2 V  
70 ns  
70 ns  
(Normal bent)  
48-ball BGA  
(8×11mm) (0.75mm ball pitch)  
2005-08-09 1/18  
1234567...18

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与TC55VCM416BSGN55相关器件

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TC55VCM416BTGN55 TOSHIBA

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TC55VCM416BTGN55LB TOSHIBA

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 		暂无描述
TC55VD1618FF-133 TOSHIBA

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TC55VD1618FFI-150 TOSHIBA

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 		IC 1M X 18 ZBT SRAM, 3.8 ns, PQFP100, 14 X 20 MM, 1.60 MM HEIGHT, 0.65 MM PITCH, PLASTIC,
TC55VD818FF-150 TOSHIBA

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 		IC 512K X 18 STANDARD SRAM, 3.8 ns, PQFP100, 14 X 20 MM, 1.60 MM HEIGHT, 0.65 MM PITCH, PL
TC55VD836FF-133 TOSHIBA

获取价格

 		IC 256K X 36 STANDARD SRAM, 4.2 ns, PQFP100, 14 X 20 MM, 1.60 MM HEIGHT, 0.65 MM PITCH, PL

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