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TC55VEM316AXBN

更新时间: 2024-09-18 22:16:11
品牌 Logo 应用领域
东芝 - TOSHIBA
页数 文件大小 规格书
14页 202K
描述
TENTATIVE TOSHIBA MOS DIGITAL INTEGRATED CIRCUIT SILICON GATE CMOS

TC55VEM316AXBN 数据手册

 浏览型号TC55VEM316AXBN的Datasheet PDF文件第2页浏览型号TC55VEM316AXBN的Datasheet PDF文件第3页浏览型号TC55VEM316AXBN的Datasheet PDF文件第4页浏览型号TC55VEM316AXBN的Datasheet PDF文件第5页浏览型号TC55VEM316AXBN的Datasheet PDF文件第6页浏览型号TC55VEM316AXBN的Datasheet PDF文件第7页 
TC55VEM316AXBN40,55  
TENTATIVE TOSHIBA MOS DIGITAL INTEGRATED CIRCUIT SILICON GATE CMOS  
524,288-WORD BY 16-BIT FULL CMOS STATIC RAM  
DESCRIPTION  
The TC55VEM316AXBN is a 8,388,608-bit static random access memory (SRAM) organized as 524,288 words by  
16 bits. Fabricated using Toshiba's CMOS Silicon gate process technology, this device operates from a single 2.3 to  
3.6 V power supply. Advanced circuit technology provides both high speed and low power at an operating current of  
3 mA/MHz and a minimum cycle time of 40 ns. It is automatically placed in low-power mode at 0.7 µA standby  
current (at VDD = 3 V, Ta = 25°C, typical) when chip enable (CE1 ) is asserted high or (CE2) is asserted low. There  
are three control inputs. CE1 and CE2 are used to select the device and for data retention control, and output  
enable (OE ) provides fast memory access. Data byte control pin ( LB , UB ) provides lower and upper byte access.  
This device is well suited to various microprocessor system applications where high speed, low power and battery  
backup are required. And, with a guaranteed operating extreme temperature range of 40° to 85°C, the  
TC55VEM316AXBN can be used in environments exhibiting extreme temperature conditions. The  
TC55VEM316AXBN is available in a plastic 48-ball BGA.  
FEATURES  
Access Times:  
Low-power dissipation  
Operating: 9 mW/MHz (typical)  
TC55VEM316AXBN  
Single power supply voltage of 2.3 to 3.6 V  
Power down features usingCE1 and CE2  
Data retention supply voltage of 1.5 to 3.6 V  
Direct TTL compatibility for all inputs and outputs  
Wide operating temperature range of 40° to 85°C  
Standby Current (maximum):  
40  
55  
Access Time  
40 ns  
40 ns  
40 ns  
25 ns  
55 ns  
55 ns  
55 ns  
30 ns  
CE1 Access Time  
CE2 Access Time  
OE Access Time  
3.6 V  
10 µA  
3.0 V  
5 µA  
Package:  
P-TFBGA48-0811-0.75BZ (Weight:  
g typ)  
PIN ASSIGNMENT (TOP VIEW)  
PIN NAMES  
48 PIN BGA  
A0~A18  
CE1 , CE2  
R/W  
Address Inputs  
Chip Enable  
1
2
3
4
5
6
A
B
LB  
OE  
UB  
A0  
A3  
A1  
A4  
A6  
A7  
A2  
CE2  
Read/Write Control  
Output Enable  
Data Byte Control  
I/O9  
CE1 I/O1  
I/O2 I/O3  
OE  
LB , UB  
C I/O10 I/O11 A5  
I/O1~I/O16 Data Inputs/Outputs  
D
E
F
V
I/O12 A17  
I/O13 OP  
I/O4  
V
DD  
SS  
DD  
V
Power  
DD  
GND  
NC  
Ground  
V
A16 I/O5  
V
SS  
No Connection  
Option  
I/O15 I/O14 A14 A15 I/O6 I/O7  
A12 A13 R/W I/O8  
A9 A10 A11 NC  
OP*  
G I/O16 NC  
A18 A8  
*: OP pin must be open or connected to GND.  
H
2002-07-23 1/14  

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