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STT3470N PDF预览

STT3470N

更新时间: 2024-09-21 08:58:47
品牌 Logo 应用领域
SECOS /
页数 文件大小 规格书
2页 184K
描述
N-Channel Enhancement Mode Mos.FET

STT3470N 数据手册

 浏览型号STT3470N的Datasheet PDF文件第2页 
STT3470N  
2.2 A, 100 V, RDS(ON) 280 m  
N-Channel Enhancement Mode Mos.FET  
Elektronische Bauelemente  
RoHS Compliant Product  
A suffix of “-C” specifies halogen and lead-free  
DESCRIPTION  
TSOP-6  
These miniature surface mount MOSFETs utilize  
A
E
a High Cell Density trench process to provide Low RDS(on)  
and to ensure minimal power loss and heat dissipation.  
Typical applications are DC-DC converters and power  
management in portable and battery-powered products  
such as computers, printers, PCMCIA cards, cellular  
and cordless telephones.  
L
6
5
4
B
1
2
3
F
C
H
J
K
D G  
FEATURES  
Low RDS(on) provides higher efficiency and extend  
battery life  
Millimeter  
Min. Max.  
Millimeter  
Low thermal impedance copper leadframe TSOP-6  
saves board space  
Fast switching speed  
REF.  
REF.  
Min.  
Max.  
A
B
C
D
E
F
2.70  
2.60  
1.40  
3.10  
3.00  
1.80  
G
H
J
K
L
0
0.10  
0.60 REF.  
0.12 REF.  
1.10 MAX.  
1.90 REF.  
0°  
10°  
High performance trench technology  
0.95 REF.  
0.30  
0.50  
PACKAGE INFORMATION  
Package  
MPQ  
3K  
LeaderSize  
D
D
D
S
TSOP-6  
7’ inch  
D
G
ABSOLUTE MAXIMUM RATINGS (TA = 25°C unless otherwise specified)  
Parameter  
Symbol  
Ratings  
Unit  
Drain-Source Voltage  
Gate-Source Voltage  
Continuous Drain Current 1  
Pulsed Drain Current 2  
VDS  
VGS  
ID  
IDM  
IS  
100  
±20  
2.2  
±10  
1.1  
V
V
TA= 25°C  
TA= 25°C  
A
A
Continuous Source Current (Diode Conduction) 1  
Power Dissipation 1  
A
PD  
Tj, Tstg  
2
W
°C  
Operating Junction and Storage Temperature Range  
-55 ~ 150  
Thermal Resistance Ratings  
Symbol  
Parameter  
Typ.  
Max.  
Unit  
t 10 sec  
93  
130  
110  
150  
Maximum Junction to Ambient 1  
RJA  
°C / W  
Steady State  
Notes  
1. Surface Mounted on 1” x 1” FR4 Board.  
2. Pulse width limited by maximum junction temperature.  
http://www.SeCoSGmbH.com/  
Any changes of specification will not be informed individually.  
30-Dec-2010 Rev. A  
Page 1 of 2  

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