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STD3NB30T4 PDF预览

STD3NB30T4

更新时间: 2024-02-06 06:39:09
品牌 Logo 应用领域
意法半导体 - STMICROELECTRONICS 开关脉冲晶体管
页数 文件大小 规格书
9页 154K
描述
3.2A, 300V, 2ohm, N-CHANNEL, Si, POWER, MOSFET, TO-252AA, DPAK-3

STD3NB30T4 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
零件包装代码:TO-252AA包装说明:DPAK-3
针数:3Reach Compliance Code:not_compliant
ECCN代码:EAR99风险等级:5.7
Is Samacsys:N雪崩能效等级(Eas):190 mJ
外壳连接:DRAIN配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:300 V最大漏极电流 (Abs) (ID):3.2 A
最大漏极电流 (ID):3.2 A最大漏源导通电阻:2 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJEDEC-95代码:TO-252AA
JESD-30 代码:R-PSSO-G2JESD-609代码:e0
元件数量:1端子数量:2
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE极性/信道类型:N-CHANNEL
最大功率耗散 (Abs):40 W最大脉冲漏极电流 (IDM):12.8 A
认证状态:Not Qualified子类别:FET General Purpose Power
表面贴装:YES端子面层:Tin/Lead (Sn/Pb)
端子形式:GULL WING端子位置:SINGLE
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

STD3NB30T4 数据手册

 浏览型号STD3NB30T4的Datasheet PDF文件第2页浏览型号STD3NB30T4的Datasheet PDF文件第3页浏览型号STD3NB30T4的Datasheet PDF文件第4页浏览型号STD3NB30T4的Datasheet PDF文件第5页浏览型号STD3NB30T4的Datasheet PDF文件第6页浏览型号STD3NB30T4的Datasheet PDF文件第7页 
STD3NB30  
- 3.2A DPAK  
N-CHANNEL 300V - 1.8  
PowerMesh MOSFET  
TYPE  
V
R
DS(on)  
I
D
DSS  
STD3NB30  
300 V  
< 2Ω  
3.2 A  
TYPICAL R (on) = 1.8Ω  
DS  
EXTREMELY HIGH dv/dt CAPABILITY  
100% AVALANCHE TESTED  
VERY LOW INTRINSIC CAPACITANCES  
GATE CHARGE MINIMIZED  
ADD SUFFIX “T4” FOR ORDERING IN TAPE &  
REEL  
3
1
DPAK  
DESCRIPTION  
Using the latest high voltage MESH OVERLAY  
process, STMicroelectronics has designed an ad-  
vanced family of power MOSFETs with outstanding  
performances. The new patent pending strip layout  
coupled with the Company’s proprieraty edge termi-  
nation structure, gives the lowest RDS(on) per area,  
exceptional avalanche and dv/dt capabilities and  
unrivalled gate charge and switching characteris-  
tics.  
INTERNAL SCHEMATIC DIAGRAM  
APPLICATIONS  
SWITH MODE POWER SUPPLIES (SMPS)  
DC-AC CONVERTERS FOR WELDING  
EQUIPMENT AND UNINTERRUPTIBLE  
POWER SUPPLIES AND MOTOR DRIVERS  
ABSOLUTE MAXIMUM RATINGS  
Symbol  
Parameter  
Drain-source Voltage (V = 0)  
Value  
300  
Unit  
V
V
DS  
GS  
V
Drain-gate Voltage (R = 20 k)  
300  
V
DGR  
GS  
V
Gate- source Voltage  
±30  
V
GS  
I
Drain Current (continuos) at T = 25°C  
3.2  
A
D
C
I
Drain Current (continuos) at T = 100°C  
2
A
D
C
I
( )  
Drain Current (pulsed)  
12.8  
45  
A
DM  
P
Total Dissipation at T = 25°C  
W
TOT  
C
Derating Factor  
0.36  
4
W/°C  
V/ns  
°C  
°C  
dv/dt(1)  
Peak Diode Recovery voltage slope  
Storage Temperature  
T
stg  
–65 to 150  
150  
T
Max. Operating Junction Temperature  
j
()Pulse width limited by safe operating area  
(1)I 3.2A, di/dt 100A/µs, V V  
, T T  
(BR)DSS j JMAX.  
SD  
DD  
May 2001  
1/9  

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