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SCES533A − DECEMBER 2003 − REVISED FEBRUARY 2004
DCT OR DCU PACKAGE
(TOP VIEW)
D
D
Available in the Texas Instruments
NanoStar and NanoFree Packages
Optimized for 1.8-V Operation and Is 3.6-V
I/O Tolerant to Support Mixed-Mode Signal
Operation
1
2
3
4
8
7
6
5
1OE
1A
2Y
V
CC
2OE
1Y
2A
D
I
Supports Partial-Power-Down Mode
off
GND
Operation
D
D
D
D
D
Sub 1-V Operable
YEP OR YZP PACKAGE
(BOTTOM VIEW)
Max t of 1.9 ns at 1.8 V
pd
Low Power Consumption, 10 µA at 1.8 V
4 5
3 6
2 7
1 8
GND
2Y
1A
2A
1Y
2OE
8-mA Output Drive at 1.8 V
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
1OE
V
CC
D
ESD Protection Exceeds JESD 22
− 2000-V Human-Body Model (A114-A)
− 200-V Machine Model (A115-A)
− 1000-V Charged-Device Model (C101)
description/ordering information
This dual bus buffer gate is operational at 0.8-V to 2.7-V V , but is designed specifically for 1.65-V to 1.95-V
CC
V
operation.
CC
The SN74AUC2G126 is a dual bus driver/line driver with 3-state outputs. The outputs are disabled when the
associated output-enable (OE) input is low.
NanoStar and NanoFree package technology is a major breakthrough in IC packaging concepts, using the
die as the package.
To ensure the high-impedance state during power up or power down, OE should be tied to GND through a
pulldown resistor; the minimum value of the resistor is determined by the current-sourcing capability of the
driver.
ORDERING INFORMATION
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
†
T
A
PACKAGE
‡
NanoStar − WCSP (DSBGA)
0.23-mm Large Bump − YEP
Tape and reel SN74AUC2G126YEPR
Tape and reel SN74AUC2G126YZPR
_ _ _UN_
NanoFree − WCSP (DSBGA)
0.23-mm Large Bump − YZP (Pb-free)
−40°C to 85°C
SSOP − DCT
Tape and reel SN74AUC2G126DCTR
Tape and reel SN74AUC2G126DCUR
U26_ _ _
UN_
VSSOP − DCU
†
‡
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site.
DCU: The actual top-side marking has one additional character that designates the assembly/test site.
YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one
following character to designate the assembly/test site. Pin
1 identifier indicates solder-bump composition
(1 = SnPb, • = Pb-free).
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoStar and NanoFree are trademarks of Texas Instruments.
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Copyright 2004, Texas Instruments Incorporated
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