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SN74AUC2G126 PDF预览

SN74AUC2G126

更新时间: 2024-11-16 05:17:39
品牌 Logo 应用领域
德州仪器 - TI 输出元件
页数 文件大小 规格书
12页 258K
描述
DUAL BUS BUFFER GATE WITH 3-STATE OUTPUTS

SN74AUC2G126 数据手册

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ꢀꢁ ꢂꢃ ꢄꢅ ꢆꢇ ꢈ ꢉꢇ ꢊ  
ꢋꢅꢄ ꢌ ꢍꢅꢀ ꢍꢅꢎ ꢎꢏ ꢐ ꢈ ꢄꢑꢏ  
ꢒ ꢓꢑ ꢔ ꢕ ꢖꢀꢑꢄꢑ ꢏ ꢗ ꢅꢑ ꢘ ꢅꢑꢀ  
SCES533A − DECEMBER 2003 − REVISED FEBRUARY 2004  
DCT OR DCU PACKAGE  
(TOP VIEW)  
D
D
Available in the Texas Instruments  
NanoStarand NanoFreePackages  
Optimized for 1.8-V Operation and Is 3.6-V  
I/O Tolerant to Support Mixed-Mode Signal  
Operation  
1
2
3
4
8
7
6
5
1OE  
1A  
2Y  
V
CC  
2OE  
1Y  
2A  
D
I
Supports Partial-Power-Down Mode  
off  
GND  
Operation  
D
D
D
D
D
Sub 1-V Operable  
YEP OR YZP PACKAGE  
(BOTTOM VIEW)  
Max t of 1.9 ns at 1.8 V  
pd  
Low Power Consumption, 10 µA at 1.8 V  
4 5  
3 6  
2 7  
1 8  
GND  
2Y  
1A  
2A  
1Y  
2OE  
8-mA Output Drive at 1.8 V  
Latch-Up Performance Exceeds 100 mA Per  
JESD 78, Class II  
1OE  
V
CC  
D
ESD Protection Exceeds JESD 22  
− 2000-V Human-Body Model (A114-A)  
− 200-V Machine Model (A115-A)  
− 1000-V Charged-Device Model (C101)  
description/ordering information  
This dual bus buffer gate is operational at 0.8-V to 2.7-V V , but is designed specifically for 1.65-V to 1.95-V  
CC  
V
operation.  
CC  
The SN74AUC2G126 is a dual bus driver/line driver with 3-state outputs. The outputs are disabled when the  
associated output-enable (OE) input is low.  
NanoStarand NanoFreepackage technology is a major breakthrough in IC packaging concepts, using the  
die as the package.  
To ensure the high-impedance state during power up or power down, OE should be tied to GND through a  
pulldown resistor; the minimum value of the resistor is determined by the current-sourcing capability of the  
driver.  
ORDERING INFORMATION  
ORDERABLE  
PART NUMBER  
TOP-SIDE  
MARKING  
T
A
PACKAGE  
NanoStar− WCSP (DSBGA)  
0.23-mm Large Bump − YEP  
Tape and reel SN74AUC2G126YEPR  
Tape and reel SN74AUC2G126YZPR  
_ _ _UN_  
NanoFree− WCSP (DSBGA)  
0.23-mm Large Bump − YZP (Pb-free)  
−40°C to 85°C  
SSOP − DCT  
Tape and reel SN74AUC2G126DCTR  
Tape and reel SN74AUC2G126DCUR  
U26_ _ _  
UN_  
VSSOP − DCU  
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at  
www.ti.com/sc/package.  
DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site.  
DCU: The actual top-side marking has one additional character that designates the assembly/test site.  
YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one  
following character to designate the assembly/test site. Pin  
1 identifier indicates solder-bump composition  
(1 = SnPb, = Pb-free).  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
NanoStar and NanoFree are trademarks of Texas Instruments.  
ꢑꢤ  
Copyright 2004, Texas Instruments Incorporated  
ꢠ ꢤ ꢡ ꢠꢙ ꢚꢮ ꢜꢛ ꢟ ꢧꢧ ꢥꢟ ꢝ ꢟ ꢞ ꢤ ꢠ ꢤ ꢝ ꢡ ꢩ  
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  

SN74AUC2G126 替代型号

型号 品牌 替代类型 描述 数据表
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