SMG2334N
3.5A, 30V, RDS(ON) 60m
N-Channel Enhancement MOSFET
Elektronische Bauelemente
RoHS Compliant Product
A suffix of “-C” specifies halogen & lead-free
DESCRIPTION
SC-59
These miniature surface mount MOSFETs utilize a
high cell density trench process to provide low RDS(on) and
to ensure minimal power loss and heat dissipation.
A
L
3
3
Top View
C B
1
1
2
FEATURES
2
K
F
E
Low RDS(on) provides higher efficiency and
extends battery life.
D
Low thermal impedance copper leadframe
SC-59 saves board space.
H
J
G
Fast switching speed.
High performance trench technology.
Millimeter
Min. Max.
Millimeter
Min. Max.
0.10 REF.
0.40 REF.
REF.
REF.
A
B
C
D
2.70
2.25
1.30
1.00
3.10
3.00
1.70
1.40
G
H
J
0.10
0.20
0.55
1.15
APPLICATION
K
0.45
0.85
E
F
1.70
0.35
2.30
0.50
L
DC-DC converters and power management in
portable and battery-powered products such as
computers, printers, PCMCIA cards, cellular and
cordless telephones.
Drain
Gate
PACKAGE INFORMATION
Package
MPQ
LeaderSize
SC-59
3K
7’ inch
Source
MAXIMUM RATINGS (TA = 25°C unless otherwise specified)
Parameter Symbol
Ratings
30
Unit
V
Drain-Source Voltage
Gate-Source Voltage
VDS
VGS
±12
V
TA=25°C
TA=70°C
3.5
Continuous Drain Current 1
ID
A
2.8
Pulsed Drain Current 2
IDM
IS
16
A
A
Continuous Source Current (Diode Conduction) 1
TA=25°C
TA=70°C
Operating Junction and Storage Temperature Range
1.25
1.3
Power Dissipation 1
PD
W
0.8
TJ, TSTG
-55 ~ 150
°C
Thermal Resistance Ratings
t≦10 sec
RθJA
Steady-State
100
166
Maximum Junction to Ambient 1
Notes:
°C/W
1.
2.
Surface Mounted on 1” x 1” FR4 Board.
Pulse width limited by maximum junction temperature.
http://www.SeCoSGmbH.com/
Any changes of specification will not be informed individually.
16-Mar-2011 Rev. A
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