SMG2343P
-3.6 A, -30 V, RDS(ON) 0.057
P-Channel Enhancement MOSFET
Elektronische Bauelemente
RoHS Compliant Product
A suffix of “-C” specifies halogen & lead-free
SC-59
DESCRIPTION
The miniature surface mount MOSFETs utilize a high cell density trench process
To provide low RDS(on) and to ensure minimal power loss and heat dissipation.
Typical applications are DC-DC converters and power management in
portable and battery-powered products such as computers, printers,
PCMCIA cards, cellular and cordless telephones.
A
L
3
3
Top View
C B
FEATURES
1
Low RDS(on) provides higher efficiency and extends battery life.
Low thermal impedance copper leadframe SC-59 saves board
space.
Fast switching speed.
High performance trench technology.
1
2
2
K
F
E
D
H
J
G
Millimeter
Min. Max.
Millimeter
REF.
REF.
Min.
0.10 REF.
0.40 REF.
Max.
PRODUCT SUMMARY
PRODUCT SUMMARY
A
B
C
D
2.70
2.25
1.30
1.00
3.10
3.00
1.70
1.40
G
H
J
0.10
0.45
0.20
0.55
K
VDS(V)
RDS(on) (
0.057@VGS= -10V
0.089@VGS= -4.5V
ID(A)
-3.6
-2.8
E
F
1.70
0.35
2.30
0.50
L
0.85
1.15
-30
PACKAGE INFORMATION
Package
MPQ
3K
LeaderSize
SC-59
7’ inch
ABSOLUTE MAXIMUM RATINGS AND THERMAL DATA(TA = 25°C unless otherwise specified)
PARAMETER
Drain-Source Voltage
SYMBOL
VDS
RATING
-30
UNIT
V
Gate-Source Voltage
VGS
±25
V
TA=25°C
TA=70°C
-3.6
Continuous Drain Current A
ID
A
-2.9
Pulsed Drain Current B
Continuous Source Current (Diode Conduction) A
IDM
IS
±10
A
A
-0.4
TA=25°C
TA=70°C
-1.25
-0.8
Power Dissipation A
PD
W
Operating Junction and Storage Temperature Range
TJ, TSTG
-55 ~ 150
°C
THERMAL RESISTANCE DATA
t≦5 sec
RθJA
100
150
Maximum Junction to Ambient A
°C/W
Steady-State
Notes
a. Surface Mounted on 1” x 1” FR4 Board.
b. Pulse width limited by maximum junction temperature.
http://www.SeCoSGmbH.com/
Any changes of specification will not be informed individually.
12-Nov-2010 Rev. A
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