SMG2358N
2.8 A, 60 V, RDS(ON) 92 m
N-Channel Enhancement Mode Mos.FET
Elektronische Bauelemente
RoHS Compliant Product
A suffix of “-C” specifies halogen and lead-free
DESCRIPTION
SC-59
These miniature surface mount MOSFETs utilize a High Cell Density
trench process to provide Low RDS(on) and to ensure minimal power
loss and heat dissipation. Typical applications are DC-DC converters
and power management in portable and battery-powered products
such as computers, printers, PCMCIA cards, cellular and cordless
telephones.
A
L
3
3
Top View
C B
1
1
2
2
K
F
E
FEATURES
D
Low RDS(on) provides higher efficiency and extends battery life.
H
J
G
Low thermal impedance copper leadframe SC-59 saves
board space.
Fast switching speed.
High performance trench technology.
Millimeter
Millimeter
Min. Max.
0.10 REF.
0.40 REF.
REF.
REF.
Min.
Max.
3.10
3.00
1.70
1.40
A
B
C
D
2.70
2.25
1.30
1.00
G
H
J
PACKAGE INFORMATION
0.10
0.45
0.85
0.20
0.55
1.15
Package
MPQ
3K
LeaderSize
K
E
F
1.70
0.35
2.30
0.50
L
SC-59
7’ inch
ABSOLUTE MAXIMUM RATINGS(TA=25°C UNLESS OTHERWISE NOTED)
Ratings
Maximum
60
Parameter
Symbol
Unit
Drain-Source Voltage
Gate-Source Voltage
VDS
VGS
V
V
±20
ID @ TA=25°C
ID @ TA=70°C
2.8
1.8
±15
1.7
A
Continuous Drain Current 1
ID
A
Pulsed Drain Current 2
Continuous Source Current (Diode Conduction) 1
Power Dissipation 1
IDM
IS
A
A
PD @ TA=25°C
PD @ TA=70°C
1.3
0.8
-55 ~ 150
W
W
°C
PD
Operating Junction and Storage Temperature Range
Tj, Tstg
THERMAL RESISTANCE RATINGS
Symbol
Parameter
Maximum
Unit
t ≦ 5 sec
RJA
100
166
Maximum Junction to Ambient 1
°C / W
Steady State
Notes
1
2
Surface Mounted on 1” x 1” FR4 Board.
Pulse width limited by maximum junction temperature.
http://www.SeCoSGmbH.com/
Any changes of specification will not be informed individually.
02-Dec-2010 Rev. B
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