SMG2345P
-3.2A , -40V , RDS(ON) 164 mΩ
P-Channel Enhancement MOSFET
Elektronische Bauelemente
RoHS Compliant Product
A suffix of “-C” specifies halogen & lead-free
DESCRIPTION
SC-59
These miniature surface mount MOSFETs utilize a high
cell density trench process to provide low RDS(on) and to
A
L
ensure minimal power loss and heat dissipation.
3
3
Top View
C B
1
1
2
FEATURES
2
K
F
E
ꢀ
Low RDS(on) provides higher efficiency and extends
battery life.
D
H
J
ꢀ
Low thermal impedance copper leadframe SC-59
saves board space.
G
Millimeter
Min. Max.
Millimeter
ꢀ
ꢀ
Fast switching speed.
High performance trench technology.
REF.
REF.
Min.
0.10 REF.
0.40 REF.
Max.
A
B
C
D
2.70
2.25
1.30
1.00
3.10
3.00
1.70
1.40
G
H
J
0.10
0.45
0.85
0.20
0.55
1.15
K
E
F
1.70
0.35
2.30
0.50
L
APPLICATION
DC-DC converters and power management
in portable and battery-powered products such as computers,
printers, PCMCIA cards, cellular and cordless telephones.
PACKAGE INFORMATION
Package
MPQ
Leader Size
SC-59
3K
7 inch
ABSOLUTE MAXIMUM RATINGS (TA=25°C unless otherwise specified)
Parameter
Symbol
Rating
-40
Unit
Drain-Source Voltage
Gate-Source Voltage
VDS
V
V
VGS
±20
TA=25°C
TA=70°C
-3.2
Continuous Drain Current 1
ID
A
-2.7
Pulsed Drain Current 2
IDM
IS
-10
A
A
Continuous Source Current (Diode Conduction) 1
TA=25°C
TA=70°C
Operating Junction and Storage Temperature Range
0.4
1.25
0.8
Power Dissipation 1
PD
W
°C
TJ, TSTG
-55~150
Thermal Resistance Data
t ≦ 5 sec
100
150
Maximum Junction to Ambient 1
RθJA
°C / W
Steady-State
Notes:
1. Surface Mounted on 1” x 1” FR4 Board.
2. Pulse width limited by maximum junction temperature.
http://www.SeCoSGmbH.com/
Any changes of specification will not be informed individually.
26-Aug-2013 Rev. A
Page 1 of 2