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SKM50GB12V PDF预览

SKM50GB12V

更新时间: 2024-11-18 06:11:51
品牌 Logo 应用领域
赛米控丹佛斯 - SEMIKRON 晶体晶体管功率控制双极性晶体管局域网
页数 文件大小 规格书
3页 385K
描述
SKM50GB12V

SKM50GB12V 技术参数

是否Rohs认证: 符合生命周期:Active
零件包装代码:MODULE包装说明:FLANGE MOUNT, R-XUFM-X11
针数:11Reach Compliance Code:compliant
ECCN代码:EAR99风险等级:5.67
Is Samacsys:N其他特性:UL RECOGNIZED
外壳连接:ISOLATED最大集电极电流 (IC):79 A
集电极-发射极最大电压:1200 V配置:SERIES CONNECTED, CENTER TAP, 2 ELEMENTS WITH BUILT-IN DIODE
门极-发射极最大电压:20 VJESD-30 代码:R-XUFM-X11
元件数量:2端子数量:11
最高工作温度:175 °C封装主体材料:UNSPECIFIED
封装形状:RECTANGULAR封装形式:FLANGE MOUNT
峰值回流温度(摄氏度):NOT SPECIFIED极性/信道类型:N-CHANNEL
认证状态:Not Qualified子类别:Insulated Gate BIP Transistors
表面贴装:NO端子形式:UNSPECIFIED
端子位置:UPPER处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:POWER CONTROL晶体管元件材料:SILICON
VCEsat-Max:2.3 VBase Number Matches:1

SKM50GB12V 数据手册

 浏览型号SKM50GB12V的Datasheet PDF文件第2页浏览型号SKM50GB12V的Datasheet PDF文件第3页 
SKM50GB12V  
Absolute Maximum Ratings  
Symbol Conditions  
Values  
Unit  
IGBT  
VCES  
1200  
79  
V
A
A
A
A
V
Tc = 25 °C  
Tc = 80 °C  
IC  
Tj = 175 °C  
60  
ICnom  
50  
ICRM  
ICRM = 3xICnom  
150  
VGES  
-20 ... 20  
SEMITRANS® 2  
VCC = 720 V  
VGE 15 V  
VCES 1200 V  
Tj = 125 °C  
tpsc  
10  
µs  
°C  
Tj  
-40 ... 175  
Inverse diode  
Tc = 25 °C  
Tc = 80 °C  
IF  
65  
49  
A
A
Tj = 175 °C  
SKM50GB12V  
IFnom  
IFRM  
IFSM  
Tj  
50  
A
Target Data  
IFRM = 3xIFnom  
tp = 10 ms, sin 180°, Tj = 25 °C  
150  
A
Features  
• VCE(sat) with positive temperature  
coefficient  
270  
A
-40 ... 175  
°C  
Module  
It(RMS)  
Tstg  
• High short circuit capability, self  
limiting to 6 x Icnom  
200  
-40 ... 125  
4000  
A
°C  
V
• Fast & soft inverse CAL diodes  
• Large clearance (10 mm) and  
creepage distances (20 mm)  
• Isolated copper baseplate using DBC  
Technology (Direct Copper Bonding)  
• UL recognized, file no. E63532  
Visol  
AC sinus 50Hz, t = 1 min  
Characteristics  
Symbol Conditions  
IGBT  
min.  
typ.  
max.  
Unit  
Typical Applications*  
• AC inverter drives  
• UPS  
• Electronic welders at fsw up to 20 kHz  
IC = 50 A  
VCE(sat)  
Tj = 25 °C  
1.85  
2.2  
2.3  
V
V
V
GE = 15 V  
Tj = 150 °C  
2.65  
chiplevel  
Tj = 25 °C  
Tj = 150 °C  
Tj = 25 °C  
Tj = 150 °C  
VCE0  
rCE  
0.94  
0.88  
18.2  
26.4  
6.5  
1.25  
1.22  
21.0  
28.6  
7
V
V
mΩ  
mΩ  
V
VGE = 15 V  
VGE(th)  
ICES  
VGE=VCE, IC = 2 mA  
VGE = 0 V  
6
Tj = 25 °C  
Tj = 150 °C  
f = 1 MHz  
f = 1 MHz  
f = 1 MHz  
0.1  
0.3  
mA  
mA  
nF  
nF  
nF  
nC  
V
CE = 1200 V  
Cies  
Coes  
Cres  
QG  
3
VCE = 25 V  
GE = 0 V  
0.30  
0.295  
540  
4.0  
V
RGint  
td(on)  
tr  
Tj = 150 °C  
Tj = 150 °C  
Tj = 150 °C  
Tj = 150 °C  
Tj = 150 °C  
Tj = 150 °C  
ns  
VCC = 600 V  
IC = 50 A  
ns  
V
GE = ±15 V  
Eon  
td(off)  
tf  
5
4
mJ  
ns  
R
R
G on = 13 Ω  
G off = 13 Ω  
ns  
Eoff  
Rth(j-c)  
mJ  
K/W  
per IGBT  
0.53  
GB  
© by SEMIKRON  
Rev. 0 – 23.12.2009  
1

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