Datasheet > SiR401DP

SiR401DP

更新时间： 2024-11-19 14:52:55

品牌	Logo	应用领域
威世 - VISHAY		/
页数	文件大小	规格书
13页	356K
描述
P-Channel 20 V (D-S) MOSFET

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SiR401DP 数据手册

SiR401DP

Vishay Siliconix

www.vishay.com

P-Channel 20 V (D-S) MOSFET

FEATURES

PowerPAK^®SO-8 Single

• TrenchFET^®power MOSFET

• 100% R_gand UIS tested

• Material categorization:

for definitions of compliance please see

www.vishay.com/doc?99912

APPLICATIONS

• Adaptor switch

• Battery switch

• Load switch

Top View

Bottom View

PRODUCT SUMMARY

V_DS(V)

-20

_DS(on)max. () at V_GS= -10 V

_DS(on)max. () at V_GS= -4.5 V

_DS(on)max. () at V_GS= -2.5 V

0.0032

0.0042

0.0077

Q_gtyp. (nC)

I_D(A) ^d

P-Channel MOSFET

-50

Configuration

Single

ORDERING INFORMATION

Package

PowerPAK SO-8

Lead (Pb)-free and halogen-free

SiR401DP-T1-GE3

ABSOLUTE MAXIMUM RATINGS (T_A= 25 °C, unless otherwise noted)

PARAMETER

SYMBOL

LIMIT

-20

UNIT

Drain-source voltage

Gate-source voltage

V_DS

V_GS

T_C= 25 °C

_C= 70 °C

T_A= 25 °C

T_A= 70 °C

-50 ^d

-29 ^{a, b}

-23.5 ^{a, b}

-80

-35.5 ^d

-4.5 ^{a, b}

-30

Continuous drain current (T_J= 150 °C)

I_D

Pulsed drain current (t = 300 μs)

I_DM

I_S

_C= 25 °C

Continuous source-drain diode current

T_A= 25 °C

L = 0.1 mH

T_C= 25 °C

Avalanche current

Single-pulse avalanche energy

I_AS

E_AS

_C= 70 °C

5 ^{a, b}

3.2 ^{a, b}

-55 to +150

260

Maximum power dissipation

P_D

T_A= 25 °C

T_A= 70 °C

Operating junction and storage temperature range

Soldering recommendations (peak temperature) ^{e, f}

T_J, T_stg

°C

THERMAL RESISTANCE RATINGS

PARAMETER

Maximum junction-to-ambient ^{a, c}

SYMBOL

TYPICAL

MAXIMUM

UNIT

°C/W

t  10 s

Steady state

R_thJA

R_thJC

Maximum junction-to-case

2.1

3.2

Notes

a. Surface mounted on 1" x 1" FR4 board

b. t = 10 s

c. Maximum under steady state conditions is 70 °C/W

d. Package limited

e. See solder profile (www.vishay.com/doc?73257). The PowerPAK SO-8 is a leadless package. The end of the lead terminal is exposed copper

(not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not

required to ensure adequate bottom side solder interconnection

f. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components

S12-0334-Rev. A, 13-Feb-12

Document Number: 63661

For technical questions, contact: pmostechsupport@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

12 3 4 5 6 7...13

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