Datasheet > SIJ4409DP

SIJ4409DP

更新时间： 2024-11-22 17:01:39

品牌	Logo	应用领域
威世 - VISHAY		/
页数	文件大小	规格书
7页	183K
描述
P-Channel 60 V (D-S) MOSFET

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SIJ4409DP 数据手册

SIJ4409DP

Vishay Siliconix

www.vishay.com

P-Channel 40 V (D-S) MOSFET

FEATURES

PowerPAK^®SO-8L Single

• New generation p-channel power MOSFET

• Ultra low R_DSx Q_gFOM product

• 100 % R_gand UIS tested

• Material categorization: for definitions of

compliance please see

www.vishay.com/doc?99912

APPLICATIONS

• Battery and circuit protection

• Load switch

Top View

Bottom View

PRODUCT SUMMARY

V_DS(V)

• Motor drive control

-40

R_DS(on)max. () at V_GS= -10 V

R_DS(on)max. () at V_GS= -4.5 V

Q_gtyp. (nC)

0.0096

0.0125

38.1

I_D(A) ^a

-43.6

P-Channel MOSFET

Configuration

Single

ORDERING INFORMATION

Package

Lead (Pb)-free and halogen-free

PowerPAK^®SO-8L

SIJ4409DP-T1-GE3

ABSOLUTE MAXIMUM RATINGS (T_A= 25 °C, unless otherwise noted)

PARAMETER

Drain-source voltage

Gate-source voltage

SYMBOL

LIMIT

-40

UNIT

V_DS

V_GS

_C= 25 °C

-43.6

-34.9

-15.5 ^{b, c}

T_C= 70 °C

T_A= 25 °C

T_A= 70 °C

Continuous drain current (T_J= 150 °C)

I_D

-12.4 ^{b, c}

Pulsed drain current (t = 100 μs)

I_DM

I_S

-200

_C= 25 °C

-29.9

-3.8 ^{b, c}

-30

Continuous source-drain diode current

T_A= 25 °C

Single pulse avalanche current

Single pulse avalanche energy

I_AS

E_AS

L = 0.1 mH

T_C= 25 °C

32.8

21.0

2.6 ^{b, c}

1.7 ^{b, c}

-55 to +150

260

T_C= 70 °C

T_A= 25 °C

T_A= 70 °C

Maximum power dissipation

P_D

Operating junction and storage temperature range

Soldering recommendations (peak temperature) ^d

T_J, T_stg

°C

THERMAL RESISTANCE RATINGS

PARAMETER

Maximum junction-to-ambient ^b

SYMBOL

R_thJA

TYPICAL

MAXIMUM

UNIT

t  10 s

Steady state

°C/W

Maximum junction-to-case (drain)

R_thJC

3.0

3.8

Notes

a. T_C= 25 °C

b. Surface mounted on 1" x 1" FR4 board

c. t = 10 s

d. See solder profile (www.vishay.com/doc?73257). The PowerPAK SO-8 is a leadless package. The end of the lead terminal is exposed copper

(not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not

required to ensure adequate bottom side solder interconnection

e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components

f. Maximum under steady state conditions is 70 °C/W

S24-0026-Rev. A, 15-Jan-2024

Document Number: 62490

For technical questions, contact: pmostechsupport@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

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