Datasheet > SiJK140E

SiJK140E

更新时间： 2024-04-09 19:00:24

品牌	Logo	应用领域
威世 - VISHAY		/
页数	文件大小	规格书
6页	188K
描述
N-Channel 40 V (D-S) MOSFET

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SiJK140E 数据手册

SiJK140E

Vishay Siliconix

www.vishay.com

N-Channel 40 V (D-S) MOSFET

FEATURES

• TrenchFET^®Gen V power MOSFET

PowerPAK^®10 x 12

• Leadership R_DS(on)minimizes power loss from

conduction

• 100 % R_gand UIS tested

• Standard level FET

• Enhance power dissipation and lower R_thJC

• Material categorization: for definitions of compliance

please see www.vishay.com/doc?99912

APPLICATIONS

Top View

Bottom View

• Synchronous rectification

• Automation

• OR-ing and hot swap switch

• Power supplies

• Motor drive control

PRODUCT SUMMARY

V_DS(V)

0.00047

312

_DS(on)max. () at V_GS= 10 V

Q_gtyp. (nC)

_D(A) ^a

795

• Battery management

Configuration

Single

N-Channel MOSFET

ORDERING INFORMATION

Package

PowerPAK^®10 x 12

SiJK140E-T1-GE3

Lead (Pb)-free and halogen-free

ABSOLUTE MAXIMUM RATINGS (T_A= 25 °C, unless otherwise noted)

PARAMETER

Drain-source voltage

Gate-source voltage

SYMBOL

LIMIT

UNIT

V_DS

V_GS

T_C= 25 °C

795

_C= 100 °C

562

Continuous drain current (T_J= 175 °C)

I_D

T_A= 25 °C

140 ^{b, c}

99 ^{b, c}

900

487

15 ^{b, c}

T_A= 100 °C

Pulsed drain current (t = 100 μs)

I_DM

I_S

_C= 25 °C

Continuous source-drain diode current

T_A= 25 °C

Single pulse avalanche current

Single pulse avalanche energy

I_AS

E_AS

100

500

536

L = 0.1 mH

T_C= 25 °C

T_C= 100 °C

268

Maximum power dissipation

P_D

T_A= 25 °C

17 ^{b, c}

8.3 ^{b, c}

-55 to +175

260

T_A= 100 °C

Operating junction and storage temperature range

Soldering recommendations (peak temperature) ^c

T_J, T_stg

°C

THERMAL RESISTANCE RATINGS

PARAMETER

SYMBOL

R_thJA

R_thJC

TYPICAL

6.3

0.21

MAXIMUM

UNIT

Maximum junction-to-ambient ^b

t  10 s

Steady state

0.28

°C/W

Maximum junction-to-case (drain)

Notes

a. T_C= 25 °C

b. Surface mounted on 1" x 1" FR4 board

c. t = 10 s

d. See solder profile (www.vishay.com/doc?73257). The PowerPAK 10 x 12 is a leadless package. The end of the lead terminal is exposed

copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed

and is not required to ensure adequate bottom side solder interconnection

e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components

f. Maximum under steady state conditions is 39 °C/W

S24-0009-Rev. A, 08-Jan-2024

Document Number: 62451

For technical questions, contact: pmostechsupport@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

12 3 4 5 6

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