SiJA52ADP
Vishay Siliconix
www.vishay.com
N-Channel 40 V (D-S) MOSFET
FEATURES
PowerPAK® SO-8L Single
• TrenchFET® Gen IV power MOSFET
• Tuned for the lowest RDS-Qoss FOM
• 100 % Rg and UIS tested
D
• Qgd/Qgs ratio < 1 optimizes switching
characteristics
1
S
2
S
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
3
S
4
1
G
D
APPLICATIONS
Top View
Bottom View
• Synchronous rectification
• High power density DC/DC
• DC/AC inverters
PRODUCT SUMMARY
VDS (V)
RDS(on) max. () at VGS = 10 V
DS(on) max. () at VGS = 4.5 V
Qg typ. (nC)
D (A) a
40
0.00163
0.00230
32
G
• Battery and load switch
R
I
131
S
Configuration
Single
N-Channel MOSFET
ORDERING INFORMATION
Package
PowerPAK SO-8L
Lead (Pb)-free and halogen-free
SiJA52ADP-T1-GE3
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
LIMIT
40
UNIT
Drain-source voltage
Gate-source voltage
VDS
V
VGS
+20, -16
131
105
41.6 b, c
33.3 b, c
200
TC = 25 °C
C = 70 °C
T
Continuous drain current (TJ = 150 °C)
ID
TA = 25 °C
TA = 70 °C
A
Pulsed drain current (t = 100 μs)
IDM
IS
TC = 25 °C
43.6
4.3 b, c
35
Continuous source-drain diode current
TA = 25 °C
L = 0.1 mH
TC = 25 °C
Single pulse avalanche current
Single pulse avalanche energy
IAS
EAS
61
48
30.7
4.8 b, c
3 b, c
mJ
W
TC = 70 °C
Maximum power dissipation
PD
TA = 25 °C
TA = 70 °C
Operating junction and storage temperature range
Soldering recommendations (peak temperature) d, e
TJ, Tstg
-55 to +150
260
°C
THERMAL RESISTANCE RATINGS
PARAMETER
Maximum junction-to-ambient b, f
Maximum junction-to-case (drain)
SYMBOL
RthJA
RthJC
TYPICAL
MAXIMUM
UNIT
t 10 s
Steady state
22
1.7
26
2.6
°C/W
Notes
a. TC = 25 °C
b. Surface mounted on 1" x 1" FR4 board
c. t = 10 s
d. See solder profile (www.vishay.com/doc?73257). The PowerPAK SO-8L is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed
and is not required to ensure adequate bottom side solder interconnection
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless component
f. Maximum under steady state conditions is 70 °C/W
S18-0653-Rev. A, 02-Jul-2018
Document Number: 76636
1
For technical questions, contact: pmostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000