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SiJA52ADP

更新时间: 2023-12-06 20:10:13
品牌 Logo 应用领域
威世 - VISHAY /
页数 文件大小 规格书
10页 231K
描述
N-Channel 40 V (D-S) MOSFET

SiJA52ADP 数据手册

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SiJA52ADP  
Vishay Siliconix  
www.vishay.com  
N-Channel 40 V (D-S) MOSFET  
FEATURES  
PowerPAK® SO-8L Single  
• TrenchFET® Gen IV power MOSFET  
• Tuned for the lowest RDS-Qoss FOM  
• 100 % Rg and UIS tested  
D
• Qgd/Qgs ratio < 1 optimizes switching  
characteristics  
1
S
2
S
• Material categorization: for definitions of compliance  
please see www.vishay.com/doc?99912  
3
S
4
1
G
D
APPLICATIONS  
Top View  
Bottom View  
• Synchronous rectification  
• High power density DC/DC  
• DC/AC inverters  
PRODUCT SUMMARY  
VDS (V)  
RDS(on) max. () at VGS = 10 V  
DS(on) max. () at VGS = 4.5 V  
Qg typ. (nC)  
D (A) a  
40  
0.00163  
0.00230  
32  
G
• Battery and load switch  
R
I
131  
S
Configuration  
Single  
N-Channel MOSFET  
ORDERING INFORMATION  
Package  
PowerPAK SO-8L  
Lead (Pb)-free and halogen-free  
SiJA52ADP-T1-GE3  
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise noted)  
PARAMETER  
SYMBOL  
LIMIT  
40  
UNIT  
Drain-source voltage  
Gate-source voltage  
VDS  
V
VGS  
+20, -16  
131  
105  
41.6 b, c  
33.3 b, c  
200  
TC = 25 °C  
C = 70 °C  
T
Continuous drain current (TJ = 150 °C)  
ID  
TA = 25 °C  
TA = 70 °C  
A
Pulsed drain current (t = 100 μs)  
IDM  
IS  
TC = 25 °C  
43.6  
4.3 b, c  
35  
Continuous source-drain diode current  
TA = 25 °C  
L = 0.1 mH  
TC = 25 °C  
Single pulse avalanche current  
Single pulse avalanche energy  
IAS  
EAS  
61  
48  
30.7  
4.8 b, c  
3 b, c  
mJ  
W
TC = 70 °C  
Maximum power dissipation  
PD  
TA = 25 °C  
TA = 70 °C  
Operating junction and storage temperature range  
Soldering recommendations (peak temperature) d, e  
TJ, Tstg  
-55 to +150  
260  
°C  
THERMAL RESISTANCE RATINGS  
PARAMETER  
Maximum junction-to-ambient b, f  
Maximum junction-to-case (drain)  
SYMBOL  
RthJA  
RthJC  
TYPICAL  
MAXIMUM  
UNIT  
t 10 s  
Steady state  
22  
1.7  
26  
2.6  
°C/W  
Notes  
a. TC = 25 °C  
b. Surface mounted on 1" x 1" FR4 board  
c. t = 10 s  
d. See solder profile (www.vishay.com/doc?73257). The PowerPAK SO-8L is a leadless package. The end of the lead terminal is exposed  
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed  
and is not required to ensure adequate bottom side solder interconnection  
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless component  
f. Maximum under steady state conditions is 70 °C/W  
S18-0653-Rev. A, 02-Jul-2018  
Document Number: 76636  
1
For technical questions, contact: pmostechsupport@vishay.com  
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  

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