Datasheet > SiJH800E

SiJH800E

更新时间： 2023-12-06 20:03:15

品牌	Logo	应用领域
威世 - VISHAY		/
页数	文件大小	规格书
9页	231K
描述
N-Channel 80 V (D-S) 175 °C MOSFET

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SiJH800E 数据手册

SiJH800E

Vishay Siliconix

www.vishay.com

N-Channel 80 V (D-S) 175 °C MOSFET

FEATURES

• TrenchFET^®Gen IV power MOSFET

PowerPAK^®8 x 8L

• Fully lead (Pb)-free device

• Optimized Q_g, Q_gd, and Q_gd/Q_gsratio reduces

switching related power loss

• 50 % smaller footprint than D²PAK (TO-263)

• 100 % R_gand UIS tested

• Material categorization: for definitions of compliance

please see www.vishay.com/doc?99912

APPLICATIONS

Top View

Bottom View

• Synchronous rectification

• OR-ing

PRODUCT SUMMARY

V_DS(V)

R_DS(on)max. (Ω) at V_GS= 10 V

0.00155

0.00180

140

• Motor drive control

R_DS(on)max. (Ω) at V_GS= 7.5 V

• Battery management

Q_gtyp. (nC)

N-Channel MOSFET

• Power supply

I_D(A)

288

Configuration

Single

ORDERING INFORMATION

Package

Lead (Pb)-free and halogen-free

PowerPAK 8 x 8L

SIJH800E-T1-GE3

ABSOLUTE MAXIMUM RATINGS (T_A= 25 °C, unless otherwise noted)

PARAMETER

SYMBOL

LIMIT

UNIT

Drain-source voltage

Gate-source voltage

V_DS

V_GS

T_C= 25 °C

T_C= 70 °C

T_A= 25 °C

T_A= 70 °C

299

241

29 ^b

24 ^b

350

Continuous drain current (T_J= 150 °C)

I_D

Pulsed drain current (t = 100 μs)

I_DM

I_S

T_C= 25 °C

T_A= 25 °C

303

3 ^b

Continuous source-drain diode current

Single pulse avalanche current

Single pulse avalanche energy

I_AS

E_AS

245

333

233

L = 0.1 mH

T_C= 25 °C

T_C= 70 °C

T_A= 25 °C

T_A=70 °C

Maximum power dissipation

P_D

3.3 ^b

2.3 ^b

-55 to +175

260

Operating junction and storage temperature range

Soldering recommendations (peak temperature) ^c

T_J, T_stg

°C

THERMAL RESISTANCE RATINGS

PARAMETER

Maximum junction-to-ambient ^b

Maximum junction-to-case (drain)

SYMBOL

R_thJA

R_thJC

TYPICAL

0.36

MAXIMUM

UNIT

Steady state

°C/W

0.45

Notes

a. T_C= 25 °C

b. Surface mounted on 1" x 1" FR4 board

c. See solder profile (www.vishay.com/doc?73257). The PowerPAK 8 x 8L is a leadless package. The end of the lead terminal is exposed

copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed

and is not required to ensure adequate bottom side solder interconnection

d. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components

S21-0540-Rev. B, 31-May-2021

Document Number: 63064

For technical questions, contact: pmostechsupport@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

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