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SIJA52DP-T1-GE3 PDF预览

SIJA52DP-T1-GE3

更新时间: 2023-12-18 00:00:00
品牌 Logo 应用领域
威世 - VISHAY /
页数 文件大小 规格书
10页 231K
描述
MOSFET N-CH 40V 60A PPAK SO-8L

SIJA52DP-T1-GE3 数据手册

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SiJA52DP  
Vishay Siliconix  
www.vishay.com  
N-Channel 40 V (D-S) MOSFET  
FEATURES  
PRODUCT SUMMARY  
• TrenchFET® Gen IV power MOSFET  
• Tuned for the lowest RDS-Qoss FOM  
• 100 % Rg and UIS tested  
VDS (V)  
RDS(on) () Max.  
0.0017 at VGS = 10 V  
0.0023 at VGS = 4.5 V  
ID (A) a, g Qg (Typ.)  
60  
40  
47.5 nC  
60  
• Qgd / Qgs ratio < 1 optimizes switching  
characteristics  
PowerPAK® SO-8L Single  
• Material categorization: for definitions of compliance  
please see www.vishay.com/doc?99912  
D
APPLICATIONS  
• Synchronous rectification  
• ORing  
D
1
S
2
S
3
• High power density DC/DC  
• VRMs and embedded DC/DC  
• DC/AC inverters  
S
4
G
G
1
Top View  
Bottom View  
N-Channel MOSFET  
Ordering Information:  
SiJA52DP-T1-GE3 (lead (Pb)-free and halogen-free)  
• Load switch  
S
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise noted)  
Parameter  
Symbol  
Limit  
Unit  
Drain-Source Voltage  
Gate-Source Voltage  
VDS  
40  
V
VGS  
+20, -16  
60 g  
60 g  
39.6 b, c  
31.3 b, c  
150  
T
C = 25 °C  
C = 70 °C  
T
Continuous Drain Current (TJ = 150 °C)  
ID  
TA = 25 °C  
TA = 70 °C  
A
Pulsed Drain Current (t = 100 μs)  
IDM  
IS  
TC = 25 °C  
56.8  
4.3 b, c  
Continuous Source-Drain Diode Current  
TA = 25 °C  
Single Pulse Avalanche Current  
Single Pulse Avalanche Energy  
IAS  
35  
L = 0.1 mH  
EAS  
61  
mJ  
W
T
C = 25 °C  
C = 70 °C  
48  
T
30.7  
Maximum Power Dissipation  
PD  
TA = 25 °C  
TA = 70 °C  
4.8 b, c  
3 b, c  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak Temperature) d, e  
TJ, Tstg  
-55 to +150  
260  
°C  
THERMAL RESISTANCE RATINGS  
Parameter  
Maximum Junction-to-Ambient b, f  
Symbol  
RthJA  
Typical  
Maximum  
Unit  
t 10 s  
22  
26  
°C/W  
Maximum Junction-to-Case (Drain)  
Steady State  
RthJC  
1.7  
2.6  
Notes  
a. TC = 25 °C.  
b. Surface mounted on 1" x 1" FR4 board.  
c. t = 10 s.  
d. See solder profile (www.vishay.com/doc?73257). The PowerPAK SO-8L is a leadless package. The end of the lead terminal is exposed  
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed  
and is not required to ensure adequate bottom side solder interconnection.  
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.  
f. Maximum under steady state conditions is 65 °C/W.  
g. Package limited.  
S16-0749-Rev. A, 25-Apr-16  
Document Number: 67387  
1
For technical questions, contact: pmostechsupport@vishay.com  
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  

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