SiJA54ADP
Vishay Siliconix
www.vishay.com
N-Channel 40 V (D-S) MOSFET
FEATURES
• TrenchFET® Gen IV power MOSFET
PowerPAK® SO-8L Single
• Very low Qg and Qoss reduce power
loss and improve efficiency
D
• Flexible leads provide resilience to
mechanical stress
1
S
2
S
• 100 % Rg and UIS tested
3
S
• Qgd/Qgs ratio < 1 optimizes switching characteristics
4
1
G
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
Top View
Bottom View
PRODUCT SUMMARY
VDS (V)
RDS(on) max. (Ω) at VGS = 10 V
D
APPLICATIONS
40
0.0023
0.00335
21.5
• Synchronous rectification
• High power density DC/DC
RDS(on) max. (Ω) at VGS = 4.5 V
G
• DC/AC inverters
Qg typ. (nC)
ID (A) a
Configuration
126
Single
N-Channel MOSFET
S
ORDERING INFORMATION
Package
PowerPAK SO-8L
Lead (Pb)-free and halogen-free
SIJA54ADP-T1-GE3
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise noted)
PARAMETER
Drain-source voltage
Gate-source voltage
SYMBOL
LIMIT
40
+20, -16
126
UNIT
VDS
VGS
V
TC = 25 °C
C = 70 °C
T
100
Continuous drain current (TJ = 150 °C)
ID
TA = 25 °C
TA = 70 °C
35.4 b, c
28.3 b, c
300
A
Pulsed drain current (t = 100 μs)
IDM
IS
T
C = 25 °C
59.7
4.7 b, c
Continuous source-drain diode current
TA = 25 °C
Single pulse avalanche current
Single pulse avalanche energy
IAS
25
L = 0.1 mH
EAS
31.25
65.7
42.1
mJ
W
T
T
C = 25 °C
C = 70 °C
Maximum power dissipation
PD
TA = 25 °C
TA = 70 °C
5.2 b, c
3.3 b, c
-55 to +150
260
Operating junction and storage temperature range
Soldering recommendations (peak temperature) d, e
TJ, Tstg
°C
THERMAL RESISTANCE RATINGS
PARAMETER
Maximum junction to ambient b, f
SYMBOL
RthJA
RthJC
TYPICAL
MAXIMUM
UNIT
t ≤ 10 s
Steady state
20
1.5
24
1.9
°C/W
Maximum junction to case (drain)
Notes
a. TC = 25 °C
b. Surface mounted on 1" x 1" FR4 board
c. t = 10 s
d. See solder profile (www.vishay.com/doc?73257). The PowerPAK SO-8L is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed
and is not required to ensure adequate bottom side solder interconnection
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components
f. Maximum under steady state conditions is 62.5 °C/W
S22-0214-Rev. A, 28-Feb-2022
Document Number: 62065
1
For technical questions, contact: pmostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000