Datasheet > SiJA22DP

SiJA22DP

更新时间： 2023-12-06 20:01:24

品牌	Logo	应用领域
威世 - VISHAY		/
页数	文件大小	规格书
10页	236K
描述
N-Channel 25 V (D-S) MOSFET

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SiJA22DP 数据手册

SiJA22DP

Vishay Siliconix

www.vishay.com

N-Channel 25 V (D-S) MOSFET

FEATURES

PowerPAK^®SO-8L Single

• TrenchFET^®Gen IV power MOSFET

• Tuned for the lowest R_DS-Q_ossFOM

• 100 % R_gand UIS tested

• Q_gd/Q_gsratio < 1 optimizes switching

characteristics

• Material categorization: for definitions of compliance

please see www.vishay.com/doc?99912

APPLICATIONS

Top View

Bottom View

• Synchronous rectification

PRODUCT SUMMARY

V_DS(V)

• High power density DC/DC

• Hot-swap switch and OR-ing FET

0.00074

0.00140

R_DS(on)max. () at V_GS= 10 V

• Battery and load switch

R_DS(on)max. () at V_GS= 4.5 V

Q_gtyp. (nC)

_D(A) ^a

201

N-Channel MOSFET

Configuration

Single

ORDERING INFORMATION

Package

PowerPAK SO-8L

SiJA22DP-T1-GE3

Lead (Pb)-free and halogen-free

ABSOLUTE MAXIMUM RATINGS (T_A= 25 °C, unless otherwise noted)

PARAMETER

Drain-source voltage

Gate-source voltage

SYMBOL

LIMIT

UNIT

V_DS

V_GS

+20, -16

201

T_C= 25 °C

T_C= 70 °C

T_A= 25 °C

T_A= 70 °C

161

Continuous drain current (T_J= 150 °C)

I_D

64 ^{b, c}

51 ^{b, c}

160

Pulsed drain current (t = 100 μs)

I_DM

I_S

T_C= 25 °C

43.6

4.3 ^{b, c}

Continuous source-drain diode current

T_A= 25 °C

Single pulse avalanche current

Single pulse avalanche energy

I_AS

L = 0.1 mH

E_AS

125

T_C= 25 °C

T_C= 70 °C

T_A= 25 °C

T_A= 70 °C

30.7

4.8 ^{b, c}

3 ^{b, c}

Maximum power dissipation

P_D

Operating junction and storage temperature range

Soldering recommendations (peak temperature) ^{d, e}

T_J, T_stg

-55 to +150

260

°C

THERMAL RESISTANCE RATINGS

PARAMETER

Maximum junction-to-ambient ^{b, f}

SYMBOL

R_thJA

TYPICAL

MAXIMUM

UNIT

t  10 s

Steady state

°C/W

Maximum junction-to-case (drain)

R_thJC

1.7

2.6

Notes

a. T_C= 25 °C

b. Surface mounted on 1" x 1" FR4 board

c. t = 10 s

d. See solder profile (www.vishay.com/doc?73257). The PowerPAK SO-8L is a leadless package. The end of the lead terminal is exposed

copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed

and is not required to ensure adequate bottom side solder interconnection

e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless component

f. Maximum under steady state conditions is 70 °C/W

S20-0555-Rev. A, 20-Jul-2020

Document Number: 78024

For technical questions, contact: pmostechsupport@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

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