SiJ462ADP
Vishay Siliconix
www.vishay.com
N-Channel 60 V (D-S) MOSFET
FEATURES
• TrenchFET® Gen IV power MOSFET
PowerPAK® SO-8L Single
• Very low Qg and Qoss reduce power
loss and improve efficiency
D
• Flexible leads provide resilience to
mechanical stress
1
S
• 100 % Rg and UIS tested
2
S
3
• Qgd/Qgs ratio < 1 optimizes switching characteristics
S
4
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
1
G
Top View
Bottom View
D
APPLICATIONS
PRODUCT SUMMARY
VDS (V)
60
• Synchronous rectification
• High power density DC/DC
R
R
DS(on) max. (Ω) at VGS = 10 V
DS(on) max. (Ω) at VGS = 4.5 V
0.0072
0.0110
15
G
• DC/AC inverters
Qg typ. (nC)
D (A) a
• Boost converters
I
39.3
N-Channel MOSFET
S
• Motor drive control
Configuration
Single
ORDERING INFORMATION
Package
PowerPAK SO-8L
Lead (Pb)-free and halogen-free
SiJ462ADP-T1-GE3
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
LIMIT
60
20
UNIT
Drain-source voltage
Gate-source voltage
VDS
VGS
V
TC = 25 °C
TC = 70 °C
TA = 25 °C
TA = 70 °C
39.3
31.4
15.8 b, c
12.6 b, c
100
Continuous drain current (TJ = 150 °C)
ID
A
Pulsed drain current (t = 100 μs)
IDM
IS
TC = 25 °C
TA = 25 °C
20.2
3.2 b, c
Continuous source-drain diode current
Single pulse avalanche current
Single pulse avalanche energy
IAS
EAS
15
11.25
22.3
L = 0.1 mH
mJ
W
TC = 25 °C
TC = 70 °C
TA = 25 °C
TA = 70 °C
14.2
Maximum power dissipation
PD
3.6 b, c
2.3 b, c
-55 to +150
260
Operating junction and storage temperature range
Soldering recommendations (peak temperature) d, e
TJ, Tstg
°C
THERMAL RESISTANCE RATINGS
PARAMETER
Maximum junction-to-ambient b, f
Maximum junction-to-case (drain)
SYMBOL
RthJA
RthJC
TYPICAL
MAXIMUM
UNIT
t ≤ 10 s
Steady state
27
4.5
34
5.6
°C/W
Notes
a. TC = 25 °C
b. Surface mounted on 1" x 1" FR4 board
c. t = 10 s
d. See solder profile (www.vishay.com/doc?73257). The PowerPAK SO-8L is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed
and is not required to ensure adequate bottom side solder interconnection
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components
f. Maximum under steady state conditions is 70 °C/W
S19-1099-Rev. A, 30-Dec-2019
Document Number: 77286
1
For technical questions, contact: pmostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000