Datasheet > SiJ470DP

SiJ470DP

更新时间： 2024-11-22 14:55:51

品牌	Logo	应用领域
威世 - VISHAY		/
页数	文件大小	规格书
10页	168K
描述
N-Channel 100 V (D-S) MOSFET

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SiJ470DP 数据手册

SiJ470DP

Vishay Siliconix

www.vishay.com

N-Channel 100 V (D-S) MOSFET

FEATURES

PRODUCT SUMMARY

• ThunderFET^®Technology Optimizes Balance

of R_DS(on), Q_g, Q_swand Q_oss

V_DS(V)

R_DS(on)() Max.

0.0091 at V_GS= 10 V

0.0100 at V_GS= 7.5 V

I_D(A)^a

58.8

Q_g(Typ.)

• 100 % R_gand UIS Tested

100

28.5 nC

54.6

• Material categorization: 

For definitions of compliance please see

www.vishay.com/doc?99912

PowerPAK^®SO-8L Single

APPLICATIONS

• Primary Side Switching

• Synchronous Rectification

• DC/AC Inverters

• LED Backlighting

• High Current Switching

Ordering Information:

SiJ470DP-T1-GE3 (Lead (Pb)-free and Halogen-free)

N-Channel MOSFET

ABSOLUTE MAXIMUM RATINGS (T_A= 25 °C, unless otherwise noted)

Parameter

Symbol

Limit

100

Unit

Drain-Source Voltage

Gate-Source Voltage

V_DS

V_GS

_C= 25 °C

_C= 70 °C

58.8

Continuous Drain Current (T_J= 150 °C)

I_D

T_A= 25 °C

T_A= 70 °C

17.4^{b, c}

13.9^{b, c}

150

Pulsed Drain Current (t = 100 μs)

I_DM

I_S

_C= 25 °C

51.6

4.5^{b, c}

Continuous Source-Drain Diode Current

T_A= 25 °C

Single Pulse Avalanche Current

Single Pulse Avalanche Energy

I_AS

L = 0.1 mH

E_AS

_C= 25 °C

_C= 70 °C

56.8

36.3

5^{b, c}

3.2^{b, c}

- 55 to 150

260

Maximum Power Dissipation

P_D

T_A= 25 °C

T_A= 70 °C

Operating Junction and Storage Temperature Range

Soldering Recommendations (Peak Temperature)^{d, e}

T_J, T_stg

°C

THERMAL RESISTANCE RATINGS

Parameter

Maximum Junction-to-Ambient^{b, f}

Symbol

R_thJA

Typical

Maximum

Unit

t  10 s

°C/W

Maximum Junction-to-Case (Drain)

Steady State

R_thJC

1.8

2.2

Notes

a. T_C= 25 °C.

b. Surface mounted on 1" x 1" FR4 board.

c. t = 10 s.

d. See solder profile (www.vishay.com/doc?73257). The PowerPAK SO-8L is a leadless package. The end of the lead terminal is exposed

copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed

and is not required to ensure adequate bottom side solder interconnection.

e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.

f. Maximum under steady state conditions is 65 °C/W.

S13-1672-Rev. A, 29-Jul-13

Document Number: 62883

For technical questions, contact: pmostechsupport@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

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