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SIJ482DP PDF预览

SIJ482DP

更新时间: 2024-02-26 03:26:51
品牌 Logo 应用领域
威世 - VISHAY /
页数 文件大小 规格书
10页 200K
描述
N-Channel 80 V (D-S) MOSFET

SIJ482DP 数据手册

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New Product  
SiJ482DP  
Vishay Siliconix  
N-Channel 80 V (D-S) MOSFET  
FEATURES  
TrenchFET® Power MOSFET  
PRODUCT SUMMARY  
VDS (V)  
RDS(on) () (Max.)  
0.0062 at VGS = 10 V  
0.0065 at VGS = 7.5 V  
0.0095 at VGS = 4.5 V  
Qg (Typ.)  
100 % Rg and UIS Tested  
Capable of Operating with 5 V Gate Drive  
Material categorization:  
I
D (A)a, g  
80  
60  
24 nC  
For definitions of compliance please see  
www.vishay.com/doc?99912  
PowerPAK® SO-8L Single  
APPLICATIONS  
D
DC/DC Primary Side Switch  
Synchronous Rectification  
High Current Switching  
G
D
4
G
3
S
S
2
S
1
N-Channel MOSFET  
S
Ordering Information:  
SiJ482DP-T1-GE3 (Lead (Pb)-free and Halogen-free)  
ABSOLUTE MAXIMUM RATINGS (T = 25 °C, unless otherwise noted)  
A
Parameter  
Symbol  
Limit  
80  
Unit  
VDS  
Drain-Source Voltage  
Gate-Source Voltage  
V
VGS  
20  
60g  
60g  
21.1b, c  
16.9b, c  
100  
60g  
4.5b, c  
30  
TC = 25 °C  
C = 70 °C  
T
Continuous Drain Current (TJ = 150 °C)  
ID  
TA = 25 °C  
TA = 70 °C  
A
IDM  
IS  
Pulsed Drain Current (t = 300 µs)  
TC = 25 °C  
Continuous Source-Drain Diode Current  
TA = 25 °C  
L =0.1 mH  
TC = 25 °C  
IAS  
Single Pulse Avalanche Current  
Single Pulse Avalanche Energy  
EAS  
mJ  
W
45  
69.4  
T
C = 70 °C  
44.4  
PD  
Maximum Power Dissipation  
5b, c  
3.2b, c  
TA = 25 °C  
TA = 70 °C  
TJ, Tstg  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak Temperature)d, e  
- 55 to 150  
260  
°C  
THERMAL RESISTANCE RATINGS  
Parameter  
Maximum Junction-to-Ambientb, f  
Maximum Junction-to-Case (Drain)  
Symbol  
RthJA  
Typical  
20  
Maximum  
Unit  
t 10 s  
25  
°C/W  
Steady State  
RthJC  
1.3  
1.8  
Notes:  
a. Based on TC = 25 °C.  
b. Surface mounted on 1" x 1" FR4 board.  
c. t = 10 s.  
d. See solder profile (www.vishay.com/doc?73257). The PowerPAK SO-8L is a leadless package. The end of the lead terminal is exposed copper  
(not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not  
required to ensure adequate bottom side solder interconnection.  
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.  
f. Maximum under steady state conditions is 65 °C/W.  
g. Package limited.  
Document Number: 63728  
S12-0544-Rev. A, 12-Mar-12  
For technical support, please contact: pmostechsupport@vishay.com  
This document is subject to change without notice.  
www.vishay.com  
1
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  

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