Datasheet > SiJ450DP

SiJ450DP

更新时间： 2024-11-22 14:51:15

品牌	Logo	应用领域
威世 - VISHAY		/
页数	文件大小	规格书
10页	233K
描述
N-Channel 45 V (D-S) MOSFET

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SiJ450DP 数据手册

SiJ450DP

Vishay Siliconix

www.vishay.com

N-Channel 45 V (D-S) MOSFET

FEATURES

• TrenchFET^®Gen IV power MOSFET

PowerPAK^®SO-8L Single

• Very low Q_gand Q_ossreduce power

loss and improve efficiency

• Flexible leads provide resilience to

mechanical stress

• 100 % R_gand UIS tested

• Q_gd/Q_gsratio < 1 optimizes switching characteristics

• Material categorization: for definitions of compliance

please see www.vishay.com/doc?99912

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PRODUCT SUMMARY

V_DS(V)

APPLICATIONS

0.0019

0.00265

113

Single

• Synchronous rectification

• High power density DC/DC

_DS(on)max. (Ω) at V_GS= 10 V

_DS(on)max. (Ω) at V_GS= 4.5 V

Q_gtyp. (nC)

_D(A) ^a

• DC/AC inverters

N-Channel MOSFET

Configuration

ORDERING INFORMATION

Package

Lead (Pb)-free and halogen-free

PowerPAK SO-8L

SIJ450DP-T1-GE3

ABSOLUTE MAXIMUM RATINGS (T_A= 25 °C, unless otherwise noted)

PARAMETER

SYMBOL

LIMIT

+20, -16

113

UNIT

Drain-source voltage

Gate-source voltage

V_DS

V_GS

T_C= 25 °C

T_C= 70 °C

T_A= 25 °C

T_A= 70 °C

Continuous drain current (T_J= 150 °C)

I_D

36 ^{b, c}

28.7 ^{b, c}

300

Pulsed drain current (t = 100 μs)

I_DM

I_S

T_C= 25 °C

T_A= 25 °C

43.6

4.3 ^{b, c}

Continuous source-drain diode current

Single pulse avalanche current

Single pulse avalanche energy

I_AS

E_AS

30.7

L = 0.1 mH

T_C= 25 °C

T_C= 70 °C

Maximum power dissipation

P_D

T_A= 25 °C

T_A= 70 °C

4.8 ^{b, c}

3.0 ^{b, c}

-55 to +150

260

Operating junction and storage temperature range

Soldering recommendations (peak temperature) ^{d, e}

T_J, T_stg

°C

THERMAL RESISTANCE RATINGS

PARAMETER

Maximum junction-to-ambient ^{b, f}

Maximum junction-to-case (drain)

SYMBOL

R_thJA

R_thJC

TYPICAL

MAXIMUM

UNIT

t ≤ 10 s

Steady state

1.7

2.6

°C/W

Notes

a. T_C= 25 °C

b. Surface mounted on 1" x 1" FR4 board

c. t = 10 s

d. See solder profile (www.vishay.com/doc?73257). The PowerPAK SO-8L is a leadless package. The end of the lead terminal is exposed

copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed

and is not required to ensure adequate bottom side solder interconnection

e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components

f. Maximum under steady state conditions is 70 °C/W

S21-0018-Rev. A, 18-Jan-2021

Document Number: 63030

For technical questions, contact: pmostechsupport@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

12 3 4 5 6 7...10

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