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SIHF18N50D-E3 PDF预览

SIHF18N50D-E3

更新时间: 2024-11-23 21:09:23
品牌 Logo 应用领域
威世 - VISHAY 局域网开关脉冲晶体管
页数 文件大小 规格书
8页 170K
描述
TRANSISTOR POWER, FET, FET General Purpose Power

SIHF18N50D-E3 技术参数

生命周期:Active包装说明:FLANGE MOUNT, R-PSFM-T3
Reach Compliance Code:unknown风险等级:2.11
雪崩能效等级(Eas):115 mJ外壳连接:ISOLATED
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:500 V
最大漏极电流 (Abs) (ID):18 A最大漏极电流 (ID):18 A
最大漏源导通电阻:0.28 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JEDEC-95代码:TO-220ABJESD-30 代码:R-PSFM-T3
元件数量:1端子数量:3
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:FLANGE MOUNT峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):39 W
最大脉冲漏极电流 (IDM):53 A子类别:FET General Purpose Powers
表面贴装:NO端子形式:THROUGH-HOLE
端子位置:SINGLE处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

SIHF18N50D-E3 数据手册

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SiHF18N50D  
Vishay Siliconix  
www.vishay.com  
D Series Power MOSFET  
FEATURES  
PRODUCT SUMMARY  
• Optimal Design  
550  
VDS (V) at TJ max.  
DS(on) max. at 25 °C ()  
Qg (max.) (nC)  
- Low Area Specific On-Resistance  
- Low Input Capacitance (Ciss  
- Reduced Capacitive Switching Losses  
- High Body Diode Ruggedness  
- Avalanche Energy Rated (UIS)  
• Optimal Efficiency and Operation  
- Low Cost  
R
VGS = 10 V  
0.28  
)
76  
11  
Q
gs (nC)  
gd (nC)  
Q
17  
Configuration  
Single  
- Simple Gate Drive Circuitry  
- Low Figure-of-Merit (FOM): Ron x Qg  
- Fast Switching  
D
TO-220 FULLPAK  
• Material categorization: For definitions of compliance  
please see www.vishay.com/doc?99912  
Note  
* Lead (Pb)-containing terminations are not RoHS-compliant.  
Exemptions may apply.  
G
APPLICATIONS  
• Consumer Electronics  
S
N-Channel MOSFET  
- Displays (LCD or Plasma TV)  
S
D
G
• Server and Telecom Power Supplies  
- SMPS  
• Industrial  
- Welding  
- Induction Heating  
- Motor Drives  
• Battery Chargers  
ORDERING INFORMATION  
Package  
TO-220 FULLPAK  
SiHF18N50D-E3  
Lead (Pb)-free  
ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted)  
PARAMETER  
SYMBOL  
LIMIT  
UNIT  
Drain-Source Voltage  
Gate-Source Voltage  
Gate-Source Voltage AC (f > 1 Hz)  
VDS  
500  
30  
V
VGS  
30  
TC = 25 °C  
TC =100 °C  
18  
Continuous Drain Current (TJ = 150 °C)e  
VGS at 10 V  
ID  
11  
A
Pulsed Drain Currenta  
IDM  
53  
Linear Derating Factor  
Single Pulse Avalanche Energyb  
0.3  
W/°C  
mJ  
W
EAS  
PD  
115  
Maximum Power Dissipation  
39  
Operating Junction and Storage Temperature Range  
Drain-Source Voltage Slope  
Reverse Diode dV/dt (d)  
TJ, Tstg  
- 55 to + 150  
°C  
TJ = 125 °C  
24  
0.4  
300  
dV/dt  
V/ns  
°C  
Soldering Recommendations (Peak Temperature)c  
for 10 s  
Notes  
a. Repetitive rating; pulse width limited by maximum junction temperature.  
b. VDD = 50 V, starting TJ = 25 °C, L = 2.3 mH, Rg = 25 , IAS = 10 A.  
c. 1.6 mm from case.  
d. ISD ID, starting TJ = 25 °C.  
e. Limited by maximum junction temperature.  
S12-1228-Rev. A, 21-May-12  
Document Number: 91507  
1
For technical questions, contact: hvm@vishay.com  
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  

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