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SIHF510STR-E3 PDF预览

SIHF510STR-E3

更新时间: 2024-11-09 21:00:31
品牌 Logo 应用领域
威世 - VISHAY 局域网开关脉冲晶体管
页数 文件大小 规格书
10页 196K
描述
TRANSISTOR 5.6 A, 100 V, 0.54 ohm, N-CHANNEL, Si, POWER, MOSFET, TO-263AB, ROHS COMPLIANT, TO-263, D2PAK-3, FET General Purpose Power

SIHF510STR-E3 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active零件包装代码:D2PAK
包装说明:SMALL OUTLINE, R-PSSO-G2针数:4
Reach Compliance Code:unknownECCN代码:EAR99
风险等级:5.08其他特性:AVALANCHE RATED
雪崩能效等级(Eas):100 mJ外壳连接:DRAIN
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:100 V
最大漏极电流 (Abs) (ID):5.6 A最大漏极电流 (ID):5.6 A
最大漏源导通电阻:0.54 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JEDEC-95代码:TO-263ABJESD-30 代码:R-PSSO-G2
JESD-609代码:e3湿度敏感等级:1
元件数量:1端子数量:2
工作模式:ENHANCEMENT MODE最高工作温度:175 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):43 W
最大脉冲漏极电流 (IDM):20 A认证状态:Not Qualified
子类别:FET General Purpose Power表面贴装:YES
端子面层:Matte Tin (Sn)端子形式:GULL WING
端子位置:SINGLE处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

SIHF510STR-E3 数据手册

 浏览型号SIHF510STR-E3的Datasheet PDF文件第2页浏览型号SIHF510STR-E3的Datasheet PDF文件第3页浏览型号SIHF510STR-E3的Datasheet PDF文件第4页浏览型号SIHF510STR-E3的Datasheet PDF文件第5页浏览型号SIHF510STR-E3的Datasheet PDF文件第6页浏览型号SIHF510STR-E3的Datasheet PDF文件第7页 
IRF510S, SiHF510S  
Vishay Siliconix  
Power MOSFET  
FEATURES  
PRODUCT SUMMARY  
VDS (V)  
Halogen-free According to IEC 61249-2-21  
Definition  
• Surface Mount  
• Available in Tape and Reel  
• Dynamic dV/dt Rating  
• Repetitive Avalanche Rated  
• 175 °C Operating Temperature  
• Fast Switching  
• Ease of Paralleling  
• Compliant to RoHS Directive 2002/95/EC  
100  
RDS(on) ()  
VGS = 10 V  
0.54  
Qg (Max.) (nC)  
8.3  
2.3  
Q
Q
gs (nC)  
gd (nC)  
3.8  
Configuration  
Single  
D
DESCRIPTION  
Third generation Power MOSFETs from Vishay provide the  
designer with the best combination of fast switching,  
ruggedized device design, low on-resistance and  
cost-effectiveness.  
D2PAK (TO-263)  
G
The D2PAK (TO-263) is a surface mount power package  
capable of accommodating die sizes up to HEX-4. It  
provides the highest power capability and the lowest  
possible on-resistance in any existing surface mount  
package. The D2PAK (TO-263) is suitable for high current  
applications because of its low internal connection  
resistance and can dissipate up to 2.0 W in a typical surface  
mount application.  
D
G
S
S
N-Channel MOSFET  
ORDERING INFORMATION  
Package  
Lead (Pb)-free and Halogen-free  
D2PAK (TO-263)  
SiHF510S-GE3  
IRF510SPbF  
D2PAK (TO-263)  
SiHF510STRL-GE3a  
IRF510STRLPbFa  
SiHF510STL-E3a  
D2PAK (TO-263)  
SiHF510STRR-GE3a  
IRF510STRRPbFa  
SiHF510STR-E3a  
Lead (Pb)-free  
SiHF510S-E3  
Note  
a. See device orientation.  
ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted)  
PARAMETER  
Drain-Source Voltage  
Gate-Source Voltage  
SYMBOL  
VDS  
LIMIT  
100  
UNIT  
V
VGS  
20  
T
C = 25 °C  
5.6  
Continuous Drain Current  
VGS at 10 V  
ID  
T
C = 100 °C  
4.0  
A
Pulsed Drain Currenta  
IDM  
20  
Linear Derating Factor  
0.29  
0.025  
100  
W/°C  
Linear Derating Factor (PCB Mount)e  
Single Pulse Avalanche Energyb  
Avalanche Currenta  
EAS  
IAR  
mJ  
A
5.6  
Repetitive Avalanche Energya  
EAR  
4.3  
mJ  
Maximum Power Dissipation  
Maximum Power Dissipation (PCB Mount)e  
Peak Diode Recovery dV/dtc  
TC = 25 °C  
TA = 25 °C  
43  
PD  
W
V/ns  
°C  
3.7  
dV/dt  
5.5  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak Temperature)  
TJ, Tstg  
- 55 to + 175  
300d  
for 10 s  
Notes  
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).  
b. VDD = 25 V, starting TJ = 25 °C, L = 4.8 mH, Rg = 25 , IAS = 5.6 A (see fig. 12).  
c. ISD 5.6 A, dI/dt 75 A/μs, VDD VDS, TJ 175 °C.  
d. 1.6 mm from case.  
e. When mounted on 1" square PCB (FR-4 or G-10 material).  
* Pb containing terminations are not RoHS compliant, exemptions may apply  
Document Number: 91016  
S11-1044-Rev. C, 30-May-11  
www.vishay.com  
1
This document is subject to change without notice.  
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  

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