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SIHF520STRL-GE3 PDF预览

SIHF520STRL-GE3

更新时间: 2024-11-01 15:51:15
品牌 Logo 应用领域
威世 - VISHAY /
页数 文件大小 规格书
9页 184K
描述
Power Field-Effect Transistor,

SIHF520STRL-GE3 技术参数

是否Rohs认证:符合生命周期:Active
包装说明:,Reach Compliance Code:unknown
ECCN代码:EAR99Factory Lead Time:6 weeks
风险等级:5.65Is Samacsys:N
峰值回流温度(摄氏度):NOT SPECIFIED处于峰值回流温度下的最长时间:NOT SPECIFIED
Base Number Matches:1

SIHF520STRL-GE3 数据手册

 浏览型号SIHF520STRL-GE3的Datasheet PDF文件第2页浏览型号SIHF520STRL-GE3的Datasheet PDF文件第3页浏览型号SIHF520STRL-GE3的Datasheet PDF文件第4页浏览型号SIHF520STRL-GE3的Datasheet PDF文件第5页浏览型号SIHF520STRL-GE3的Datasheet PDF文件第6页浏览型号SIHF520STRL-GE3的Datasheet PDF文件第7页 
IRF520S, SiHF520S  
www.vishay.com  
Vishay Siliconix  
Power MOSFET  
FEATURES  
Halogen-free According to IEC 61249-2-21  
Definition  
PRODUCT SUMMARY  
VDS (V)  
DS(on) ()  
Qg (Max.) (nC)  
100  
R
VGS = 10 V  
0.27  
• Surface Mount  
Available  
16  
4.4  
7.7  
• Available in Tape and Reel  
• Dynamic dV/dt Rating  
• Repetitive Avalanche Rated  
• 175 °C Operating Temperature  
• Fast Switching  
Q
Q
gs (nC)  
gd (nC)  
Available  
Configuration  
Single  
• Ease of Paralleling  
D
• Material categorization: for definitions of compliance  
please see www.vishay.com/doc?99912  
Note  
D2PAK (TO-263)  
*
This datasheet provides information about parts that are  
RoHS-compliant and / or parts that are non-RoHS-compliant. For  
example, parts with lead (Pb) terminations are not RoHS-compliant.  
Please see the information / tables in this datasheet for details.  
G
DESCRIPTION  
Third generation Power MOSFETs from Vishay provide the  
designer with the best combination of fast switching,  
ruggedized device design, low on-resistance and  
cost-effectiveness.  
D
G
S
N-Channel MOSFET  
S
The D2PAK (TO-263) is a surface mount power package  
capable of accommodating die size up to HEX-4. It provides  
the highest power capability and the lowest possible  
on-resistance in any existing surface mount package. The  
D2PAK (TO-263) is suitable for high current applications  
because of its low internal connection resistance and can  
dissipate up to 2.0 W in a typical surface mount application.  
ORDERING INFORMATION  
Package  
D2PAK (TO-263)  
SiHF520S-GE3  
SiHF520STRR-GE3  
SiHF520STRL-GE3  
IRF520SPbF  
Lead (Pb)-free and Halogen-free  
Lead (Pb)-free  
ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted)  
PARAMETER  
Drain-Source Voltage  
Gate-Source Voltage  
SYMBOL  
LIMIT  
100  
20  
UNIT  
VDS  
VGS  
V
T
C = 25 °C  
9.2  
6.5  
Continuous Drain Current  
VGS at 10 V  
ID  
TC = 100 °C  
A
Pulsed Drain Currenta  
IDM  
37  
Linear Derating Factor  
0.40  
0.025  
200  
W/°C  
Linear Derating Factor (PCB Mount)e  
Single Pulse Avalanche Energyb  
Avalanche Currenta  
EAS  
IAR  
mJ  
A
9.2  
Repetitive Avalanche Energya  
EAR  
6.0  
mJ  
Maximum Power Dissipation  
Maximum Power Dissipation (PCB Mount)e  
Peak Diode Recovery dV/dtc  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak Temperature)  
T
C = 25 °C  
60  
3.7  
5.5  
PD  
W
V/ns  
°C  
TA = 25 °C  
dV/dt  
TJ, Tstg  
- 55 to + 175  
300d  
For 10 s  
Notes  
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).  
b. VDD = 25 V, starting TJ = 25 °C, L = 3.5 mH, Rg = 25 , IAS = 9.2 A (see fig. 12).  
c. ISD 9.2 A, dI/dt 110 A/μs, VDD VDS, TJ 175 °C.  
d. 1.6 mm from case.  
e. When mounted on 1" square PCB (FR-4 or G-10 material).  
S16-1000-Rev. D, 23-May-16  
Document Number: 91018  
1
For technical questions, contact: hvm@vishay.com  
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  

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