IRF520S, SiHF520S
www.vishay.com
Vishay Siliconix
Power MOSFET
FEATURES
• Halogen-free According to IEC 61249-2-21
Definition
PRODUCT SUMMARY
VDS (V)
DS(on) ()
Qg (Max.) (nC)
100
R
VGS = 10 V
0.27
• Surface Mount
Available
16
4.4
7.7
• Available in Tape and Reel
• Dynamic dV/dt Rating
• Repetitive Avalanche Rated
• 175 °C Operating Temperature
• Fast Switching
Q
Q
gs (nC)
gd (nC)
Available
Configuration
Single
• Ease of Paralleling
D
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
Note
D2PAK (TO-263)
*
This datasheet provides information about parts that are
RoHS-compliant and / or parts that are non-RoHS-compliant. For
example, parts with lead (Pb) terminations are not RoHS-compliant.
Please see the information / tables in this datasheet for details.
G
DESCRIPTION
Third generation Power MOSFETs from Vishay provide the
designer with the best combination of fast switching,
ruggedized device design, low on-resistance and
cost-effectiveness.
D
G
S
N-Channel MOSFET
S
The D2PAK (TO-263) is a surface mount power package
capable of accommodating die size up to HEX-4. It provides
the highest power capability and the lowest possible
on-resistance in any existing surface mount package. The
D2PAK (TO-263) is suitable for high current applications
because of its low internal connection resistance and can
dissipate up to 2.0 W in a typical surface mount application.
ORDERING INFORMATION
Package
D2PAK (TO-263)
SiHF520S-GE3
SiHF520STRR-GE3
SiHF520STRL-GE3
IRF520SPbF
Lead (Pb)-free and Halogen-free
Lead (Pb)-free
ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted)
PARAMETER
Drain-Source Voltage
Gate-Source Voltage
SYMBOL
LIMIT
100
20
UNIT
VDS
VGS
V
T
C = 25 °C
9.2
6.5
Continuous Drain Current
VGS at 10 V
ID
TC = 100 °C
A
Pulsed Drain Currenta
IDM
37
Linear Derating Factor
0.40
0.025
200
W/°C
Linear Derating Factor (PCB Mount)e
Single Pulse Avalanche Energyb
Avalanche Currenta
EAS
IAR
mJ
A
9.2
Repetitive Avalanche Energya
EAR
6.0
mJ
Maximum Power Dissipation
Maximum Power Dissipation (PCB Mount)e
Peak Diode Recovery dV/dtc
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)
T
C = 25 °C
60
3.7
5.5
PD
W
V/ns
°C
TA = 25 °C
dV/dt
TJ, Tstg
- 55 to + 175
300d
For 10 s
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).
b. VDD = 25 V, starting TJ = 25 °C, L = 3.5 mH, Rg = 25 , IAS = 9.2 A (see fig. 12).
c. ISD 9.2 A, dI/dt 110 A/μs, VDD VDS, TJ 175 °C.
d. 1.6 mm from case.
e. When mounted on 1" square PCB (FR-4 or G-10 material).
S16-1000-Rev. D, 23-May-16
Document Number: 91018
1
For technical questions, contact: hvm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000