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SIDC30D120H8X1SA4 PDF预览

SIDC30D120H8X1SA4

更新时间: 2024-11-05 21:21:35
品牌 Logo 应用领域
英飞凌 - INFINEON 软恢复二极管快速软恢复二极管
页数 文件大小 规格书
5页 194K
描述
Rectifier Diode, 1 Phase, 1 Element, 1200V V(RRM), Silicon, DIE-1

SIDC30D120H8X1SA4 技术参数

是否Rohs认证: 符合生命周期:Active
包装说明:S-XUUC-N1Reach Compliance Code:compliant
ECCN代码:EAR99HTS代码:8541.10.00.40
Factory Lead Time:13 weeks风险等级:5.67
应用:FAST SOFT RECOVERY配置:SINGLE
二极管元件材料:SILICON二极管类型:RECTIFIER DIODE
JESD-30 代码:S-XUUC-N1元件数量:1
相数:1端子数量:1
最高工作温度:175 °C最低工作温度:-40 °C
封装主体材料:UNSPECIFIED封装形状:SQUARE
封装形式:UNCASED CHIP峰值回流温度(摄氏度):NOT SPECIFIED
最大重复峰值反向电压:1200 V最大反向电流:27 µA
表面贴装:YES端子形式:NO LEAD
端子位置:UPPER处于峰值回流温度下的最长时间:NOT SPECIFIED
Base Number Matches:1

SIDC30D120H8X1SA4 数据手册

 浏览型号SIDC30D120H8X1SA4的Datasheet PDF文件第2页浏览型号SIDC30D120H8X1SA4的Datasheet PDF文件第3页浏览型号SIDC30D120H8X1SA4的Datasheet PDF文件第4页浏览型号SIDC30D120H8X1SA4的Datasheet PDF文件第5页 
SIDC30D120H8  
Fast switching diode chip in Emitter Controlled Technology  
Features: Recommended for:  
1200V Emitter Controlled technology  
120 µm chip  
Power modules and discrete  
devices  
Soft, fast switching  
Low reverse recovery charge  
Small temperature coefficient  
Qualified according to JEDEC for target  
applications  
Applications:  
SMPS, resonant applications,  
drives  
Chip Type  
VR  
IFn  
Die Size  
Package  
SIDC30D120H8 1200V 50A  
5.5 x 5.5 mm2  
sawn on foil  
Mechanical Parameters  
Die size  
5.5 x 5.5  
30.25  
Area total  
mm2  
Anode pad size  
Thickness  
4.78 x 4.78  
120  
µm  
Wafer size  
200  
mm  
Max. possible chips per wafer  
Passivation frontside  
Pad metal  
891  
Photoimide  
3200 nm AlSiCu  
Ni Ag system  
To achieve a reliable solder connection it is strongly  
recommended not to consume the Ni layer completely during  
production process  
Backside metal  
Die bond  
Electrically conductive epoxy glue and soft solder  
Al, 500 µm  
Wire bond  
Reject ink dot size  
0.65 mm; max 1.2 mm  
for original and  
Ambient atmosphere air, Temperature 17 °C 25 °C,  
sealed MBB bags  
< 6 months  
Storage environment  
Acc. to IEC62258-3: Atmosphere > 99% Nitrogen or inert gas,  
Humidity < 25% RH, Temperature 17 °C 25 °C, < 6 months  
for open MBB bags  
Edited by INFINEON Technologies, L4057C, Rev 2.1, 14.10.2015  

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