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RMPA1963

更新时间: 2024-09-14 21:55:39
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD 放大器功率放大器过程控制系统PCS
页数 文件大小 规格书
7页 103K
描述
US-PCS CDMA, CDMA2000-1X and WCDMA Power Amplifier Module

RMPA1963 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:ObsoleteReach Compliance Code:compliant
风险等级:5.82特性阻抗:50 Ω
构造:COMPONENT增益:23 dB
最大输入功率 (CW):10 dBm最大工作频率:1910 MHz
最小工作频率:1850 MHz最高工作温度:85 °C
最低工作温度:-30 °C射频/微波设备类型:NARROW BAND LOW POWER
最大电压驻波比:2.5Base Number Matches:1

RMPA1963 数据手册

 浏览型号RMPA1963的Datasheet PDF文件第2页浏览型号RMPA1963的Datasheet PDF文件第3页浏览型号RMPA1963的Datasheet PDF文件第4页浏览型号RMPA1963的Datasheet PDF文件第5页浏览型号RMPA1963的Datasheet PDF文件第6页浏览型号RMPA1963的Datasheet PDF文件第7页 
PRELIMINARY  
May 2005  
RMPA1963  
US-PCS CDMA, CDMA2000-1X and WCDMA  
Power Amplifier Module  
Features  
General Description  
38% CDMA/WCDMA efficiency at +28 dBm Pout  
The RMPA1963 Power Amplifier Module (PAM) is Fairchild’s lat-  
est innovation in 50 Ohm matched, surface mount modules tar-  
geting US-PCS CDMA/WCDMA/HSDPA and Wireless Local  
Loop (WLL) applications. Answering the call for ultra-low DC  
power consumption and extended battery life in portable elec-  
tronics, the RMPA1963 uses novel proprietary circuitry to dra-  
matically reduce amplifier current at low to medium RF output  
power levels (< +16 dBm), where the handset most often oper-  
ates. A simple two-state Vmode control is all that is needed to  
reduce operating current by more than 50% at 16 dBm output  
power, and quiescent current (Iccq) by as much as 70% com-  
pared to traditional power-saving methods. No additional cir-  
cuitry, such as DC-to-DC converters, are required to achieve  
this remarkable improvement in amplifier efficiency. Further, the  
4x4x1.5 mm LCC package is pin-compatible and a drop-in  
replacement for last generation 4x4 mm PAMs widely used  
today, minimizing the design time to apply this performance-  
enhancing technology. The multi-stage GaAs Microwave Mono-  
lithic Integrated Circuit (MMIC) is manufactured using Fairchild  
RF’s InGaP Heterojunction Bipolar Transistor (HBT) process.  
14% CDMA/WCDMA efficiency (85 mA total current) at  
+16 dBm Pout  
Meets HSDPA performance requirements  
Linear operation in low-power mode up to +19 dBm  
Low quiescent current (Iccq): 25 mA in low-power mode  
Single positive-supply operation with low power and shut-  
down modes  
• 3.4V typical Vcc operation  
• Low Vref (2.85V) compatible with advanced handset  
chipsets  
Compact Lead-free compliant LCC package –  
(4.0 X 4.0 x 1.5 mm nominal)  
Industry standard pinout  
Internally matched to 50 Ohms and DC blocked RF  
input/output  
Meets IS-95/CDMA2000-1XRTT/WCDMA performance  
requirements  
Device  
Functional Block Diagram  
(Top View)  
MMIC  
Vcc1  
1
2
3
4
5
Vcc2  
GND  
10  
9
INPUT  
MATCH  
RF IN  
GND  
OUTPUT  
MATCH  
RF OUT  
GND  
8
7
Vmode  
Vref  
BIAS/MODE SWITCH  
GND  
6
11 (paddle ground on package bottom)  
©2005 Fairchild Semiconductor Corporation  
1
www.fairchildsemi.com  
RMPA1963  
Rev. H  

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