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Q67000-S266 PDF预览

Q67000-S266

更新时间: 2024-09-13 22:44:11
品牌 Logo 应用领域
英飞凌 - INFINEON 开关
页数 文件大小 规格书
7页 69K
描述
MiniPROFET (High-side switch Short-circuit protection Input protection Overtemperature protection with hysteresis)

Q67000-S266 数据手册

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®
Mini PROFET BSP 450  
MiniPROFET  
High-side switch  
Short-circuit protection  
Input protection  
Overtemperature protection with hysteresis  
Overload protection  
4
Overvoltage protection  
Switching inductive load  
Clamp of negative output voltage with inductive loads  
Undervoltage shutdown  
3
2
1
Maximum current internally limited  
Electrostatic discharge (ESD) protection  
1)  
Reverse battery protection  
Package: SOT 223  
Pins  
1
2
3
4
Ordering code  
Type  
OUT  
GND  
IN  
Vbb  
BSP 450  
Q67000-S266  
Maximum Ratings  
Parameter  
Symbol Values  
Unit  
Supply voltage range  
Vbb  
IL  
-0.3...48  
V
Load current  
Maximum input voltage2)  
Maximum input current  
self-limited  
I
A
V
L(SC)  
VIN  
IIN  
-5.0...Vbb  
±5  
mA  
J
Inductive load switch-off energy dissipation  
EAS  
0.5  
single pulse  
IL = 0.5A , TA = 85°C  
Operating temperature range  
Storage temperature range  
Max. power dissipation (DC)3)  
Tj  
-40 ...+125  
-55 ...+150  
°C  
Tstg  
Ptot  
VESD  
TA = 25 °C  
1.4  
W
Electrostatic discharge capability (ESD)4)  
±1  
kV  
Thermal resistance  
chip - soldering point: RthJS  
chip - ambient3) RthJA  
7
70  
K/W  
+ V  
bb  
4
1
Vo lta g e  
so urc e  
V
Ga te  
Ove rvo lta g e  
p ro te c tio n  
Curre nt  
lim it  
p ro te c tio n  
ESD-  
Diode  
Logic  
OUT  
Cha rg e p um p  
Le ve l shifte r  
Lim it fo r  
unc la m p e d  
ind . loa d s  
Vo lta g e  
se nso r  
Te m p e ra ture  
se nso r  
Re c tifie r  
R
in  
3
IN  
Load  
Lo g ic  
ESD  
MINI-PROFET  
GND  
2
Load GND  
Signal GND  
1)  
With resistor R  
=150 in GND connection, resistor in series with IN connections reverse load current  
GND  
limited by connected load.  
2)  
3)  
4)  
At V > V , the input current is not allowed to exceed ±5 mA.  
IN  
bb  
2
BSP 450 on epoxy pcb 40 mm x 40 mm x 1.5 mm with 6 cm copper area for V connection  
HBM according to MIL-STD 883D, Methode 3015.7  
bb  
Semiconductor Group  
1
06.96  

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