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NVMYS021N06CLTWG

更新时间: 2024-11-12 11:15:43
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
7页 340K
描述
功率 MOSFET,40 V,0.9Ω,322 A,单 N 沟道

NVMYS021N06CLTWG 数据手册

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NVMYS021N06CL  
MOSFET – Power, Single  
N-Channel  
60 V, 21 mW, 27 A  
Features  
www.onsemi.com  
Small Footprint (5x6 mm) for Compact Design  
Low R  
to Minimize Conduction Losses  
DS(on)  
Low Q and Capacitance to Minimize Driver Losses  
G
V
R
MAX  
I MAX  
D
(BR)DSS  
DS(ON)  
LFPAK4 Package, Industry Standard  
21 mW @ 10 V  
60 V  
27 A  
AECQ101 Qualified and PPAP Capable  
These Devices are PbFree and are RoHS Compliant  
31.5 mW @ 4.5 V  
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
J
D (5)  
Parameter  
DraintoSource Voltage  
Symbol  
Value  
60  
Unit  
V
V
DSS  
GatetoSource Voltage  
V
20  
V
GS  
G (4)  
Continuous Drain  
Current R  
Steady  
State  
T
= 25°C  
= 100°C  
= 25°C  
I
27  
A
C
D
q
JC  
T
C
15  
(Notes 1, 2, 3)  
S (1,2,3)  
NCHANNEL MOSFET  
Power Dissipation  
T
C
P
28  
W
A
D
R
(Notes 1, 2)  
q
JC  
T
C
= 100°C  
9.0  
9.8  
6.9  
3.8  
1.9  
131  
Continuous Drain  
Current R  
Steady  
State  
T = 25°C  
A
I
D
MARKING  
DIAGRAM  
q
JA  
T = 100°C  
A
(Notes 1, 2, 3)  
D
Power Dissipation  
T = 25°C  
A
P
W
D
R
(Notes 1 & 2)  
q
JA  
T = 100°C  
A
021N06  
CL  
AWLYW  
Pulsed Drain Current  
T = 25°C, t = 10 ms  
A
I
DM  
A
p
LFPAK4  
CASE 760AB  
Operating Junction and Storage Temperature  
T , T  
J
55 to  
+ 175  
°C  
stg  
1
S
S
S
G
Source Current (Body Diode)  
I
23.5  
43  
A
S
021N06CL = Specific Device Code  
Single Pulse DraintoSource Avalanche  
E
mJ  
AS  
A
= Assembly Location  
= Wafer Lot  
= Year  
Energy (I  
= 1.1 A)  
L(pk)  
WL  
Y
W
Lead Temperature for Soldering Purposes  
(1/8from case for 10 s)  
T
260  
°C  
L
= Work Week  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
ORDERING INFORMATION  
See detailed ordering, marking and shipping information on  
page 5 of this data sheet.  
THERMAL RESISTANCE MAXIMUM RATINGS  
Parameter  
Symbol  
Value  
5.3  
Unit  
JunctiontoCase Steady State  
JunctiontoAmbient Steady State (Note 2)  
R
°C/W  
q
JC  
R
39  
q
JA  
1. The entire application environment impacts the thermal resistance values shown,  
they are not constants and are only valid for the particular conditions noted.  
2
2. Surfacemounted on FR4 board using a 650 mm , 2 oz. Cu pad.  
3. Maximum current for pulses as long as 1 second is higher but is dependent  
on pulse duration and duty cycle.  
© Semiconductor Components Industries, LLC, 2018  
1
Publication Order Number:  
July, 2019 Rev. 0  
NVMYS021N06CL/D  
 

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