NVMYS021N06CL
MOSFET – Power, Single
N-Channel
60 V, 21 mW, 27 A
Features
www.onsemi.com
• Small Footprint (5x6 mm) for Compact Design
• Low R
to Minimize Conduction Losses
DS(on)
• Low Q and Capacitance to Minimize Driver Losses
G
V
R
MAX
I MAX
D
(BR)DSS
DS(ON)
• LFPAK4 Package, Industry Standard
21 mW @ 10 V
60 V
27 A
• AEC−Q101 Qualified and PPAP Capable
• These Devices are Pb−Free and are RoHS Compliant
31.5 mW @ 4.5 V
MAXIMUM RATINGS (T = 25°C unless otherwise noted)
J
D (5)
Parameter
Drain−to−Source Voltage
Symbol
Value
60
Unit
V
V
DSS
Gate−to−Source Voltage
V
20
V
GS
G (4)
Continuous Drain
Current R
Steady
State
T
= 25°C
= 100°C
= 25°C
I
27
A
C
D
q
JC
T
C
15
(Notes 1, 2, 3)
S (1,2,3)
N−CHANNEL MOSFET
Power Dissipation
T
C
P
28
W
A
D
R
(Notes 1, 2)
q
JC
T
C
= 100°C
9.0
9.8
6.9
3.8
1.9
131
Continuous Drain
Current R
Steady
State
T = 25°C
A
I
D
MARKING
DIAGRAM
q
JA
T = 100°C
A
(Notes 1, 2, 3)
D
Power Dissipation
T = 25°C
A
P
W
D
R
(Notes 1 & 2)
q
JA
T = 100°C
A
021N06
CL
AWLYW
Pulsed Drain Current
T = 25°C, t = 10 ms
A
I
DM
A
p
LFPAK4
CASE 760AB
Operating Junction and Storage Temperature
T , T
J
−55 to
+ 175
°C
stg
1
S
S
S
G
Source Current (Body Diode)
I
23.5
43
A
S
021N06CL = Specific Device Code
Single Pulse Drain−to−Source Avalanche
E
mJ
AS
A
= Assembly Location
= Wafer Lot
= Year
Energy (I
= 1.1 A)
L(pk)
WL
Y
W
Lead Temperature for Soldering Purposes
(1/8″ from case for 10 s)
T
260
°C
L
= Work Week
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
ORDERING INFORMATION
See detailed ordering, marking and shipping information on
page 5 of this data sheet.
THERMAL RESISTANCE MAXIMUM RATINGS
Parameter
Symbol
Value
5.3
Unit
Junction−to−Case − Steady State
Junction−to−Ambient − Steady State (Note 2)
R
°C/W
q
JC
R
39
q
JA
1. The entire application environment impacts the thermal resistance values shown,
they are not constants and are only valid for the particular conditions noted.
2
2. Surface−mounted on FR4 board using a 650 mm , 2 oz. Cu pad.
3. Maximum current for pulses as long as 1 second is higher but is dependent
on pulse duration and duty cycle.
© Semiconductor Components Industries, LLC, 2018
1
Publication Order Number:
July, 2019 − Rev. 0
NVMYS021N06CL/D