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NVMYS7D3N04CLTWG PDF预览

NVMYS7D3N04CLTWG

更新时间: 2024-09-25 11:15:43
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
7页 337K
描述
功率 MOSFET,40V,7.3Ω,50 A,单 N 沟道

NVMYS7D3N04CLTWG 数据手册

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NVMYS7D3N04CL  
MOSFET – Power, Single  
N-Channel  
40 V, 7.3 mW, 52 A  
Features  
www.onsemi.com  
Small Footprint (5x6 mm) for Compact Design  
Low R  
to Minimize Conduction Losses  
DS(on)  
V
R
MAX  
I MAX  
D
(BR)DSS  
DS(on)  
Low Capacitance to Minimize Driver Losses  
LFPAK4 Package, Industry Standard  
7.3 m@ 10 V  
12 m@ 4.5 V  
40 V  
52 A  
AECQ101 Qualified and PPAP Capable  
These Devices are PbFree and are RoHS Compliant  
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
NChannel  
D (5 8)  
J
Parameter  
DraintoSource Voltage  
Symbol  
Value  
40  
Unit  
V
V
DSS  
GatetoSource Voltage  
V
GS  
20  
V
Continuous Drain Cur- Steady  
T
= 25°C  
= 100°C  
= 25°C  
I
52  
A
G (4)  
C
D
rent R  
3, 4)  
(Notes 1, 2,  
State  
JC  
T
C
29  
S (1, 2, 3)  
Power Dissipation  
(Notes 1, 2, 3)  
T
C
P
38  
W
A
D
R
JC  
T
C
= 100°C  
12  
MARKING  
DIAGRAM  
Continuous Drain Cur- Steady  
T = 25°C  
A
I
D
17  
rent R  
3, 4)  
(Notes 1 &  
State  
JA  
T = 100°C  
A
12  
Power Dissipation  
(Notes 1, 3)  
T = 25°C  
P
3.8  
1.9  
269  
W
A
D
R
JA  
7D3N04  
CL  
AWLYW  
T = 100°C  
A
Pulsed Drain Current  
T = 25°C, t = 10 s  
I
DM  
A
A
p
LFPAK4  
CASE 760AB  
Operating Junction and Storage Temperature  
T , T  
55 to  
+175  
°C  
J
stg  
Source Current (Body Diode)  
I
31  
65  
A
S
7D3N04CL = Specific Device Code  
A
WL  
Y
= Assembly Location  
= Wafer Lot  
= Year  
Single Pulse DraintoSource Avalanche  
E
AS  
mJ  
Energy (I  
= 2.9 A)  
L(pk)  
Lead Temperature for Soldering Purposes  
(1/8from case for 10 s)  
T
260  
°C  
L
W
= Work Week  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
ORDERING INFORMATION  
See detailed ordering, marking and shipping information in the  
package dimensions section on page 5 of this data sheet.  
THERMAL RESISTANCE MAXIMUM RATINGS (Note 1)  
Parameter  
Symbol  
Value  
4.0  
Unit  
JunctiontoCase Steady State (Note 3)  
JunctiontoAmbient Steady State (Note 3)  
R
°C/W  
JC  
R
39  
JA  
1. The entire application environment impacts the thermal resistance values shown,  
they are not constants and are only valid for the particular conditions noted.  
2. Psi () is used as required per JESD5112 for packages in which  
substantially less than 100% of the heat flows to single case surface.  
2
3. Surfacemounted on FR4 board using a 650 mm , 2 oz. Cu pad.  
4. Continuous DC current rating. Maximum current for pulses as long as 1  
second is higher but is dependent on pulse duration and duty cycle.  
© Semiconductor Components Industries, LLC, 2018  
1
Publication Order Number:  
July, 2019 Rev. 0  
NVMYS7D3N04CL/D  
 

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