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NVMYS2D9N04CLTWG

更新时间: 2024-11-12 11:14:23
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安森美 - ONSEMI /
页数 文件大小 规格书
7页 336K
描述
功率 MOSFET,40 V,2.8 mΩ,110 A,单 N 沟道

NVMYS2D9N04CLTWG 数据手册

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NVMYS2D9N04CL  
MOSFET – Power, Single  
N-Channel  
40 V, 2.8 mW, 110 A  
Features  
www.onsemi.com  
Small Footprint (5x6 mm) for Compact Design  
Low R  
to Minimize Conduction Losses  
DS(on)  
Low Q and Capacitance to Minimize Driver Losses  
G
V
R
MAX  
I MAX  
D
(BR)DSS  
DS(ON)  
LFPAK4 Package, Industry Standard  
2.8 mW @ 10 V  
4.4 mW @ 4.5 V  
AECQ101 Qualified and PPAP Capable  
These Devices are PbFree and are RoHS Compliant  
40 V  
110 A  
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
J
D (5)  
Parameter  
DraintoSource Voltage  
Symbol  
Value  
40  
Unit  
V
V
DSS  
GatetoSource Voltage  
V
GS  
20  
V
G (4)  
Continuous Drain  
Current R  
Steady  
State  
T
= 25°C  
= 100°C  
= 25°C  
I
110  
81  
A
C
D
q
JC  
T
C
(Notes 1, 3)  
S (1,2,3)  
NCHANNEL MOSFET  
Power Dissipation  
T
C
P
68  
W
A
D
R
(Note 1)  
q
JC  
T
C
= 100°C  
34  
Continuous Drain  
Current R  
Steady  
State  
T = 25°C  
A
I
D
27  
q
JA  
MARKING  
DIAGRAM  
T = 100°C  
A
19  
(Notes 1, 2, 3)  
Power Dissipation  
T = 25°C  
P
3.7  
1.6  
740  
W
A
D
D
R
(Notes 1, 2)  
q
JA  
T = 100°C  
A
2D9N04  
CL  
AWLYW  
Pulsed Drain Current  
T = 25°C, t = 10 ms  
I
DM  
A
A
p
LFPAK4  
CASE 760AB  
Operating Junction and Storage Temperature  
Range  
T , T  
J
55 to  
+ 175  
°C  
stg  
Source Current (Body Diode)  
I
76  
A
1
S
S
S
S
G
Single Pulse DraintoSource Avalanche  
E
AS  
215  
mJ  
2D9N04CL = Specific Device Code  
Energy (I  
= 7 A)  
L(pk)  
A
WL  
Y
= Assembly Location  
= Wafer Lot  
Lead Temperature for Soldering Purposes  
(1/8from case for 10 s)  
T
260  
°C  
L
= Year  
W
= Work Week  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
ORDERING INFORMATION  
See detailed ordering, marking and shipping information in the  
package dimensions section on page 5 of this data sheet.  
THERMAL RESISTANCE MAXIMUM RATINGS  
Parameter  
Symbol  
Value  
2.2  
Unit  
JunctiontoCase Steady State  
JunctiontoAmbient Steady State (Note 2)  
R
°C/W  
q
JC  
R
39  
q
JA  
1. The entire application environment impacts the thermal resistance values shown,  
they are not constants and are only valid for the particular conditions noted.  
2
2. Surfacemounted on FR4 board using a 650 mm , 2 oz. Cu pad.  
3. Maximum current for pulses as long as 1 second is higher but is dependent  
on pulse duration and duty cycle.  
© Semiconductor Components Industries, LLC, 2017  
1
Publication Order Number:  
July, 2019 Rev. 1  
NVMYS2D9N04CL/D  
 

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