NVMYS025N06CL
MOSFET – Power, Single
N-Channel
60 V, 27.5 mW, 21 A
Features
www.onsemi.com
• Small Footprint (5x6 mm) for Compact Design
• Low R
to Minimize Conduction Losses
DS(on)
• Low Q and Capacitance to Minimize Driver Losses
G
V
R
MAX
I MAX
D
(BR)DSS
DS(ON)
• LFPAK4 Package, Industry Standard
27.5 mW @ 10 V
43 mW @ 4.5 V
• AEC−Q101 Qualified and PPAP Capable
• These Devices are Pb−Free and are RoHS Compliant
60 V
21 A
MAXIMUM RATINGS (T = 25°C unless otherwise noted)
J
D (5)
Parameter
Drain−to−Source Voltage
Symbol
Value
60
Unit
V
V
DSS
Gate−to−Source Voltage
V
GS
20
V
G (4)
Continuous Drain
Current R
Steady
State
T
= 25°C
= 100°C
= 25°C
I
21
A
C
D
q
JC
T
C
12
(Notes 1, 2, 3)
S (1,2,3)
N−CHANNEL MOSFET
Power Dissipation
T
C
P
24
W
A
D
R
(Notes 1, 2)
q
JC
T
C
= 100°C
7.6
8.5
6.0
3.8
1.9
103
Continuous Drain
Current R
Steady
State
T = 25°C
A
I
D
q
JA
MARKING
DIAGRAM
T = 100°C
A
(Notes 1, 2, 3)
Power Dissipation
T = 25°C
A
P
W
D
R
(Notes 1, 2)
q
JA
T = 100°C
A
Pulsed Drain Current
T = 25°C, t = 10 ms
A
I
DM
A
025N06
CL
AWLYW
p
Operating Junction and Storage Temperature
Range
T , T
−55 to
+ 175
°C
J
stg
LFPAK4
CASE 760AB
Source Current (Body Diode)
I
S
20
A
Single Pulse Drain−to−Source Avalanche
E
44.6
mJ
AS
025N06CL = Specific Device Code
Energy (I
= 1.5 A)
L(pk)
A
WL
Y
= Assembly Location
= Wafer Lot
Lead Temperature for Soldering Purposes
(1/8″ from case for 10 s)
T
260
°C
L
= Year
W
= Work Week
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
THERMAL RESISTANCE MAXIMUM RATINGS
ORDERING INFORMATION
See detailed ordering, marking and shipping information on
page 5 of this data sheet.
Parameter
Symbol
Value
6.0
Unit
Junction−to−Case − Steady State
Junction−to−Ambient − Steady State (Note 2)
R
°C/W
q
JC
R
39.5
q
JA
1. The entire application environment impacts the thermal resistance values shown,
they are not constants and are only valid for the particular conditions noted.
2
2. Surface−mounted on FR4 board using a 650 mm , 2 oz. Cu pad.
3. Maximum current for pulses as long as 1 second is higher but is dependent
on pulse duration and duty cycle.
© Semiconductor Components Industries, LLC, 2018
1
Publication Order Number:
July, 2019 − Rev. 0
NVMYS025N06CL/D