DATA SHEET
www.onsemi.com
MOSFET - Power, Single
N-Channel
40 V, 1.6 mW, 185 A
V
R
MAX
I MAX
D
(BR)DSS
DS(ON)
1.6 mW @ 10 V
2.4 mW @ 4.5 V
40 V
185 A
NVMYS1D6N04CL
D (5)
Features
• Low R
to Minimize Conduction Losses
• Low Q and Capacitance to Minimize Driver Losses
DS(on)
G
• AEC−Q101 Qualified and PPAP Capable
• LFPAK4 Package, Industry Standard
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
G (4)
S (1,2,3)
N−CHANNEL MOSFET
MAXIMUM RATINGS (T = 25°C unless otherwise noted)
J
Parameter
Drain−to−Source Voltage
Symbol
Value
40
Unit
V
MARKING
DIAGRAM
V
DSS
Gate−to−Source Voltage
V
GS
20
V
D
Continuous Drain
Current R
Steady
State
T
= 25°C
= 100°C
= 25°C
I
185
130.7
107.1
53.6
35
A
C
D
1D6N04
CL
AWLYW
q
JC
T
C
(Notes 1, 3)
LFPAK4
CASE 760AB
Power Dissipation
T
C
P
W
A
D
R
(Note 1)
q
JC
T
C
= 100°C
1
S
S
S G
Continuous Drain
Current R
Steady
State
T = 25°C
A
I
D
1D6N04CL = Specific Device Code
q
JA
T = 100°C
A
24.8
3.8
(Notes 1, 2, 3)
A
= Assembly Location
= Wafer Lot
WL
Y
Power Dissipation
T = 25°C
A
P
W
D
= Year
R
(Notes 1, 2)
q
JA
T = 100°C
A
1.9
W
= Work Week
Pulsed Drain Current
T = 25°C, t = 10 ms
I
DM
1198
A
A
p
Operating Junction and Storage Temperature
Range
T , T
−55 to
+175
°C
J
stg
ORDERING INFORMATION
See detailed ordering, marking and shipping information in the
package dimensions section on page 5 of this data sheet.
Source Current (Body Diode)
I
S
89
A
Single Pulse Drain−to−Source Avalanche
E
AS
873
mJ
Energy (I
= 14.5 A)
L(pk)
Lead Temperature for Soldering Purposes
(1/8″ from case for 10 s)
T
L
260
°C
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
THERMAL RESISTANCE MAXIMUM RATINGS
Parameter
Symbol
Value
1.4
Unit
Junction−to−Case − Steady State
Junction−to−Ambient − Steady State (Note 2)
R
°C/W
q
JC
R
36.4
q
JA
1. The entire application environment impacts the thermal resistance values shown,
they are not constants and are only valid for the particular conditions noted.
2
2. Surface−mounted on FR4 board using a 650 mm , 2 oz. Cu pad.
3. Maximum current for pulses as long as 1 second is higher but is dependent
on pulse duration and duty cycle.
© Semiconductor Components Industries, LLC, 2020
1
Publication Order Number:
September, 2021 − Rev. 2
NVMYS1D6N04CL/D