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NVMYS021N10MCLTWG PDF预览

NVMYS021N10MCLTWG

更新时间: 2024-11-22 11:15:23
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
6页 219K
描述
MOSFET – Power, Single N-Channel 100 V, 23 mΩ, 31 A

NVMYS021N10MCLTWG 数据手册

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DATA SHEET  
www.onsemi.com  
MOSFET – Power, Single  
N-Channel  
V
R
MAX  
I MAX  
D
(BR)DSS  
DS(ON)  
23 mW @ 10 V  
33 mW @ 4.5 V  
100 V  
31 A  
100 V, 23 mW, 31 A  
NVMYS021N10MCL  
D (5)  
Features  
Small Footprint (5x6 mm) for Compact Design  
Low R  
to Minimize Conduction Losses  
Low Q and Capacitance to Minimize Driver Losses  
DS(on)  
G (4)  
G
AECQ101 Qualified and PPAP Capable  
These Devices are PbFree, Halogen Free/BFR Free and are RoHS  
Compliant  
S (1,2,3)  
NCHANNEL MOSFET  
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
J
MARKING  
DIAGRAM  
Parameter  
DraintoSource Voltage  
Symbol  
Value  
100  
20  
Unit  
V
V
DSS  
D
GatetoSource Voltage  
V
GS  
V
Continuous Drain  
Current R  
Steady  
State  
T
= 25°C  
I
31  
A
021N10  
MCL  
AWLYW  
C
D
q
JC  
T
C
= 100°C  
22  
(Notes 1, 3)  
LFPAK4  
CASE 760AB  
Power Dissipation  
T
C
= 25°C  
P
49  
24  
W
A
D
R
(Note 1)  
q
JC  
1
T
C
= 100°C  
S
S
S
G
Continuous Drain  
Current R  
Steady  
State  
T = 25°C  
A
I
I
8.4  
D
021N10MCL = Specific Device Code  
q
JA  
A
= Assembly Location  
= Wafer Lot  
T = 100°C  
A
5.9  
(Notes 1, 2, 3)  
D
WL  
Y
Power Dissipation  
T = 25°C  
A
P
3.6  
1.8  
159  
W
D
= Year  
R
(Notes 1, 2)  
q
JA  
W
= Work Week  
T = 100°C  
A
Pulsed Drain Current  
T = 25°C, t = 10 ms  
A
I
DM  
A
p
Operating Junction and Storage Temperature  
Range  
T , T  
55 to  
°C  
J
stg  
ORDERING INFORMATION  
See detailed ordering, marking and shipping information on  
page 5 of this data sheet.  
+175  
Source Current (Body Diode  
I
S
37  
A
Single Pulse DraintoSource Avalanche  
E
AS  
179  
mJ  
Energy (I  
= 1.4 A)  
L(pk)  
Lead Temperature for Soldering Purposes  
(1/8from case for 10 s)  
T
L
260  
°C  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
THERMAL RESISTANCE MAXIMUM RATINGS  
Parameter  
Symbol  
Value  
3.1  
Unit  
JunctiontoCase Steady State  
JunctiontoAmbient Steady State (Note 2)  
R
°C/W  
q
JC  
R
42  
q
JA  
1. The entire application environment impacts the thermal resistance values shown,  
they are not constants and are only valid for the particular conditions noted.  
2
2. Surfacemounted on FR4 board using a 650 mm , 2 oz. Cu pad.  
3. Maximum current for pulses as long as 1 second is higher but is dependent  
on pulse duration and duty cycle.  
© Semiconductor Components Industries, LLC, 2020  
1
Publication Order Number:  
June, 2022 Rev. 0  
NVMYS021N10MCL/D  
 

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