DATA SHEET
www.onsemi.com
MOSFET – Power, Single
N-Channel
V
R
MAX
I MAX
D
(BR)DSS
DS(ON)
23 mW @ 10 V
33 mW @ 4.5 V
100 V
31 A
100 V, 23 mW, 31 A
NVMYS021N10MCL
D (5)
Features
• Small Footprint (5x6 mm) for Compact Design
• Low R
to Minimize Conduction Losses
• Low Q and Capacitance to Minimize Driver Losses
DS(on)
G (4)
G
• AEC−Q101 Qualified and PPAP Capable
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
S (1,2,3)
N−CHANNEL MOSFET
MAXIMUM RATINGS (T = 25°C unless otherwise noted)
J
MARKING
DIAGRAM
Parameter
Drain−to−Source Voltage
Symbol
Value
100
20
Unit
V
V
DSS
D
Gate−to−Source Voltage
V
GS
V
Continuous Drain
Current R
Steady
State
T
= 25°C
I
31
A
021N10
MCL
AWLYW
C
D
q
JC
T
C
= 100°C
22
(Notes 1, 3)
LFPAK4
CASE 760AB
Power Dissipation
T
C
= 25°C
P
49
24
W
A
D
R
(Note 1)
q
JC
1
T
C
= 100°C
S
S
S
G
Continuous Drain
Current R
Steady
State
T = 25°C
A
I
I
8.4
D
021N10MCL = Specific Device Code
q
JA
A
= Assembly Location
= Wafer Lot
T = 100°C
A
5.9
(Notes 1, 2, 3)
D
WL
Y
Power Dissipation
T = 25°C
A
P
3.6
1.8
159
W
D
= Year
R
(Notes 1, 2)
q
JA
W
= Work Week
T = 100°C
A
Pulsed Drain Current
T = 25°C, t = 10 ms
A
I
DM
A
p
Operating Junction and Storage Temperature
Range
T , T
−55 to
°C
J
stg
ORDERING INFORMATION
See detailed ordering, marking and shipping information on
page 5 of this data sheet.
+175
Source Current (Body Diode
I
S
37
A
Single Pulse Drain−to−Source Avalanche
E
AS
179
mJ
Energy (I
= 1.4 A)
L(pk)
Lead Temperature for Soldering Purposes
(1/8″ from case for 10 s)
T
L
260
°C
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
THERMAL RESISTANCE MAXIMUM RATINGS
Parameter
Symbol
Value
3.1
Unit
Junction−to−Case − Steady State
Junction−to−Ambient − Steady State (Note 2)
R
°C/W
q
JC
R
42
q
JA
1. The entire application environment impacts the thermal resistance values shown,
they are not constants and are only valid for the particular conditions noted.
2
2. Surface−mounted on FR4 board using a 650 mm , 2 oz. Cu pad.
3. Maximum current for pulses as long as 1 second is higher but is dependent
on pulse duration and duty cycle.
© Semiconductor Components Industries, LLC, 2020
1
Publication Order Number:
June, 2022 − Rev. 0
NVMYS021N10MCL/D