MOSFET - Power, Single
N-Channel
80 V, 4 mW, 110 A
NVMFS6H824NL
Features
www.onsemi.com
• Small Footprint (5x6 mm) for Compact Design
• Low R
to Minimize Conduction Losses
DS(on)
• Low Q and Capacitance to Minimize Driver Losses
G
V
R
MAX
I MAX
D
(BR)DSS
DS(ON)
• NVMFS6H824NLWF − Wettable Flank Option for Enhanced Optical
Inspection
4 mW @ 10 V
80 V
110 A
• AEC−Q101 Qualified and PPAP Capable
• These Devices are Pb−Free and are RoHS Compliant
5.2 mW @ 4.5 V
MAXIMUM RATINGS (T = 25°C unless otherwise noted)
J
D (5,6)
Parameter
Drain−to−Source Voltage
Symbol
Value
80
Unit
V
V
DSS
Gate−to−Source Voltage
V
GS
20
V
G (4)
Continuous Drain
Current R
T
= 25°C
= 100°C
= 25°C
I
110
78
A
C
D
q
JC
T
C
(Notes 1, 3)
Steady
State
S (1,2,3)
N−CHANNEL MOSFET
Power Dissipation
T
C
P
116
58
W
A
D
R
(Note 1)
q
JC
T
C
= 100°C
Continuous Drain
Current R
T = 25°C
A
I
D
20
MARKING
DIAGRAM
q
JA
T = 100°C
A
14
(Notes 1, 2, 3)
Steady
State
Power Dissipation
T = 25°C
A
P
3.8
1.9
722
W
D
D
1
R
(Notes 1, 2)
q
JA
S
S
S
G
D
D
T = 100°C
A
DFN5
(SO−8FL)
CASE 488AA
STYLE 1
XXXXXX
AYWZZ
Pulsed Drain Current
T = 25°C, t = 10 ms
I
DM
A
A
p
Operating Junction and Storage Temperature
Range
T , T
−55 to
+175
°C
J
stg
D
XXXXXX = 6H824L
XXXXXX = (NVMFS6H824NL) or
XXXXXX = 824LWF
Source Current (Body Diode)
I
96
A
S
Single Pulse Drain−to−Source Avalanche
E
AS
1081
mJ
Energy (I
= 7.0 A)
L(pk)
XXXXXX = (NVMFS6H824NLWF)
A
Y
W
ZZ
= Assembly Location
= Year
= Work Week
= Lot Traceability
Lead Temperature for Soldering Purposes
T
260
°C
L
(1/8″ from case for 10 s)
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
THERMAL RESISTANCE MAXIMUM RATINGS
ORDERING INFORMATION
See detailed ordering, marking and shipping information in the
package dimensions section on page 5 of this data sheet.
Parameter
Symbol
Value
1.3
Unit
Junction−to−Case − Steady State
Junction−to−Ambient − Steady State (Note 2)
R
°C/W
q
JC
R
40
q
JA
1. The entire application environment impacts the thermal resistance values shown,
they are not constants and are only valid for the particular conditions noted.
2
2. Surface−mounted on FR4 board using a 650 mm , 2 oz. Cu pad.
3. Maximum current for pulses as long as 1 second is higher but is dependent
on pulse duration and duty cycle.
© Semiconductor Components Industries, LLC, 2019
1
Publication Order Number:
January, 2020 − Rev. 0
NVMFS6H824NL/D