MOSFET - Power, Single
N-Channel
80 V, 32 mW, 23 A
NVMFS6H864N
Features
www.onsemi.com
• Small Footprint (5x6 mm) for Compact Design
• Low R
to Minimize Conduction Losses
DS(on)
• Low Q and Capacitance to Minimize Driver Losses
G
V
R
MAX
I MAX
D
(BR)DSS
DS(ON)
• NVMFS6H864NWF − Wettable Flank Option for Enhanced Optical
Inspection
80 V
32 mW @ 10 V
23 A
• AEC−Q101 Qualified and PPAP Capable
• These Devices are Pb−Free and are RoHS Compliant
D (5,6)
MAXIMUM RATINGS (T = 25°C unless otherwise noted)
J
Parameter
Drain−to−Source Voltage
Symbol
Value
80
Unit
V
V
DSS
G (4)
Gate−to−Source Voltage
V
GS
20
V
Continuous Drain
Current R
T
= 25°C
= 100°C
= 25°C
I
21
A
C
D
S (1,2,3)
N−CHANNEL MOSFET
q
JC
T
C
15
(Notes 1, 3)
Steady
State
Power Dissipation
T
C
P
33
W
A
D
R
(Note 1)
q
JC
T
C
= 100°C
16
MARKING
DIAGRAM
Continuous Drain
Current R
T = 25°C
A
I
D
6.7
4.8
3.5
1.7
92
q
JA
D
T = 100°C
A
(Notes 1, 2, 3)
Steady
State
1
S
S
S
G
D
D
Power Dissipation
T = 25°C
A
P
W
D
DFN5
(SO−8FL)
CASE 488AA
STYLE 1
XXXXXX
AYWZZ
R
(Notes 1, 2)
q
JA
T = 100°C
A
Pulsed Drain Current
T = 25°C, t = 10 ms
I
DM
A
A
p
D
Operating Junction and Storage Temperature
Range
T , T
−55 to
°C
J
stg
XXXXXX = 6H864N
XXXXXX = (NVMFS6H864N) or
XXXXXX = 864NWF
+175
Source Current (Body Diode)
I
S
27.5
80
A
XXXXXX = (NVMFS6H864NWF)
Single Pulse Drain−to−Source Avalanche
E
AS
mJ
A
Y
= Assembly Location
= Year
Energy (I
= 1 A)
L(pk)
W
ZZ
= Work Week
= Lot Traceability
Lead Temperature for Soldering Purposes
(1/8″ from case for 10 s)
T
L
260
°C
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
ORDERING INFORMATION
See detailed ordering, marking and shipping information in the
package dimensions section on page 5 of this data sheet.
THERMAL RESISTANCE MAXIMUM RATINGS
Parameter
Symbol
Value
4.5
Unit
Junction−to−Case − Steady State
Junction−to−Ambient − Steady State (Note 2)
R
°C/W
q
JC
R
43
q
JA
1. The entire application environment impacts the thermal resistance values shown,
they are not constants and are only valid for the particular conditions noted.
2
2. Surface−mounted on FR4 board using a 650 mm , 2 oz. Cu pad.
3. Maximum current for pulses as long as 1 second is higher but is dependent
on pulse duration and duty cycle.
© Semiconductor Components Industries, LLC, 2018
1
Publication Order Number:
June, 2020 − Rev. 2
NVMFS6H864N/D