DATA SHEET
www.onsemi.com
MOSFET - Power, Single
N-Channel
V
R
MAX
I MAX
D
(BR)DSS
DS(ON)
19.5 mW @ 10 V
25 mW @ 4.5 V
80 V
30 A
80 V, 19.5 mW, 30 A
NVMFS6H858NL
D (5,6)
Features
Small Footprint (5x6 mm) for Compact Design
G (4)
Low R
to Minimize Conduction Losses
DS(on)
Low Q and Capacitance to Minimize Driver Losses
G
NVMFS6H858NLWF − Wettable Flank Option for Enhanced Optical
S (1,2,3)
N−CHANNEL MOSFET
Inspection
AEC−Q101 Qualified and PPAP Capable
These Devices are Pb−Free and are RoHS Compliant
MARKING
DIAGRAMS
MAXIMUM RATINGS (T = 25C unless otherwise noted)
J
D
1
Parameter
Drain−to−Source Voltage
Symbol
Value
80
Unit
V
S
S
S
G
D
D
V
DSS
DFN5
(SO−8FL)
CASE 488AA
STYLE 1
XXXXXX
AYWZZ
Gate−to−Source Voltage
V
GS
20
30
V
Continuous Drain
Current R
T
= 25C
= 100C
= 25C
I
A
D
C
D
q
JC
T
C
21
(Notes 1, 3)
Steady
State
1
Power Dissipation
T
C
P
42
W
A
D
R
(Note 1)
q
JC
XXXXXX
AYWZZ
T
C
= 100C
21
Continuous Drain
Current R
T = 25C
I
8.7
6.1
3.5
1.8
142
DFNW5
(SO8FL)
CASE 507BA
A
D
q
JA
T = 100C
A
(Notes 1, 2, 3)
Steady
State
Power Dissipation
T = 25C
A
P
W
D
XXXXXX = 6H858L
R
(Notes 1, 2)
q
JA
T = 100C
A
XXXXXX = (NVMFS6H858NL) or
XXXXXX = 858LWF
XXXXXX = (NVMFS6H858NLWF)
Pulsed Drain Current
T = 25C, t = 10 ms
I
DM
A
A
p
Operating Junction and Storage Temperature
Range
T , T
−55 to
+175
C
A
Y
= Assembly Location
= Year
J
stg
W
ZZ
= Work Week
= Lot Traceability
Source Current (Body Diode)
I
S
35
A
Single Pulse Drain−to−Source Avalanche
E
AS
198
mJ
Energy (I
= 1.5 A)
L(pk)
Lead Temperature for Soldering Purposes
T
260
C
L
ORDERING INFORMATION
See detailed ordering, marking and shipping information on
page 5 of this data sheet.
(1/8 from case for 10 s)
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
THERMAL RESISTANCE MAXIMUM RATINGS
Parameter
Symbol
Value
3.6
Unit
Junction−to−Case − Steady State
Junction−to−Ambient − Steady State (Note 2)
R
C/W
q
JC
R
43
q
JA
1. The entire application environment impacts the thermal resistance values shown,
they are not constants and are only valid for the particular conditions noted.
2
2. Surface−mounted on FR4 board using a 650 mm , 2 oz. Cu pad.
3. Maximum current for pulses as long as 1 second is higher but is dependent
on pulse duration and duty cycle.
Semiconductor Components Industries, LLC, 2019
1
Publication Order Number:
November, 2022 − Rev. 1
NVMFS6H858NL/D