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NVMFS6H858NLT1G

更新时间: 2024-11-07 11:11:35
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
8页 297K
描述
Power MOSFET 80V, 32A, 20.7 mOhm, Single N-Channel, SO8-FL.

NVMFS6H858NLT1G 数据手册

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DATA SHEET  
www.onsemi.com  
MOSFET - Power, Single  
N-Channel  
V
R
MAX  
I MAX  
D
(BR)DSS  
DS(ON)  
19.5 mW @ 10 V  
25 mW @ 4.5 V  
80 V  
30 A  
80 V, 19.5 mW, 30 A  
NVMFS6H858NL  
D (5,6)  
Features  
Small Footprint (5x6 mm) for Compact Design  
G (4)  
Low R  
to Minimize Conduction Losses  
DS(on)  
Low Q and Capacitance to Minimize Driver Losses  
G
NVMFS6H858NLWF Wettable Flank Option for Enhanced Optical  
S (1,2,3)  
NCHANNEL MOSFET  
Inspection  
AECQ101 Qualified and PPAP Capable  
These Devices are PbFree and are RoHS Compliant  
MARKING  
DIAGRAMS  
MAXIMUM RATINGS (T = 25C unless otherwise noted)  
J
D
1
Parameter  
DraintoSource Voltage  
Symbol  
Value  
80  
Unit  
V
S
S
S
G
D
D
V
DSS  
DFN5  
(SO8FL)  
CASE 488AA  
STYLE 1  
XXXXXX  
AYWZZ  
GatetoSource Voltage  
V
GS  
20  
30  
V
Continuous Drain  
Current R  
T
= 25C  
= 100C  
= 25C  
I
A
D
C
D
q
JC  
T
C
21  
(Notes 1, 3)  
Steady  
State  
1
Power Dissipation  
T
C
P
42  
W
A
D
R
(Note 1)  
q
JC  
XXXXXX  
AYWZZ  
T
C
= 100C  
21  
Continuous Drain  
Current R  
T = 25C  
I
8.7  
6.1  
3.5  
1.8  
142  
DFNW5  
(SO8FL)  
CASE 507BA  
A
D
q
JA  
T = 100C  
A
(Notes 1, 2, 3)  
Steady  
State  
Power Dissipation  
T = 25C  
A
P
W
D
XXXXXX = 6H858L  
R
(Notes 1, 2)  
q
JA  
T = 100C  
A
XXXXXX = (NVMFS6H858NL) or  
XXXXXX = 858LWF  
XXXXXX = (NVMFS6H858NLWF)  
Pulsed Drain Current  
T = 25C, t = 10 ms  
I
DM  
A
A
p
Operating Junction and Storage Temperature  
Range  
T , T  
55 to  
+175  
C  
A
Y
= Assembly Location  
= Year  
J
stg  
W
ZZ  
= Work Week  
= Lot Traceability  
Source Current (Body Diode)  
I
S
35  
A
Single Pulse DraintoSource Avalanche  
E
AS  
198  
mJ  
Energy (I  
= 1.5 A)  
L(pk)  
Lead Temperature for Soldering Purposes  
T
260  
C  
L
ORDERING INFORMATION  
See detailed ordering, marking and shipping information on  
page 5 of this data sheet.  
(1/8from case for 10 s)  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
THERMAL RESISTANCE MAXIMUM RATINGS  
Parameter  
Symbol  
Value  
3.6  
Unit  
JunctiontoCase Steady State  
JunctiontoAmbient Steady State (Note 2)  
R
C/W  
q
JC  
R
43  
q
JA  
1. The entire application environment impacts the thermal resistance values shown,  
they are not constants and are only valid for the particular conditions noted.  
2
2. Surfacemounted on FR4 board using a 650 mm , 2 oz. Cu pad.  
3. Maximum current for pulses as long as 1 second is higher but is dependent  
on pulse duration and duty cycle.  
Semiconductor Components Industries, LLC, 2019  
1
Publication Order Number:  
November, 2022 Rev. 1  
NVMFS6H858NL/D  
 

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