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NVMFS6H801NT1G

更新时间: 2024-09-16 11:11:51
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
8页 320K
描述
单 N 沟道,功率 MOSFET,80 V,157 A,2.8 mΩ

NVMFS6H801NT1G 数据手册

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DATA SHEET  
www.onsemi.com  
MOSFET – Power, Single,  
N-Channel  
V
R
MAX  
I MAX  
D
(BR)DSS  
DS(ON)  
80 V  
2.8 mW @ 10 V  
157 A  
80 V, 2.8 mW, 157 A  
D (5)  
NVMFS6H801N  
Features  
Small Footprint (5x6 mm) for Compact Design  
G (4)  
Low R  
to Minimize Conduction Losses  
DS(on)  
Low Q and Capacitance to Minimize Driver Losses  
G
S (1,2,3)  
NCHANNEL MOSFET  
NVMFS6H801NWF Wettable Flank Option for Enhanced Optical  
Inspection  
AECQ101 Qualified and PPAP Capable  
These Devices are PbFree and are RoHS Compliant  
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
J
1
Parameter  
DraintoSource Voltage  
Symbol  
Value  
80  
Unit  
V
DFN5  
V
DSS  
(SO8FL)  
CASE 488AA  
STYLE 1  
DFNW5  
(FULLCUT SO8FL WF)  
CASE 507BA  
GatetoSource Voltage  
V
GS  
20  
V
Continuous Drain  
Current R  
Steady  
State  
T
= 25°C  
= 100°C  
= 25°C  
I
D
157  
111  
166  
83  
A
C
q
JC  
T
C
(Notes 1, 3)  
Power Dissipation  
T
C
P
D
W
A
MARKING DIAGRAM  
R
(Note 1)  
q
JC  
T
C
= 100°C  
D
Continuous Drain  
Current R  
Steady  
State  
T = 25°C  
A
I
D
23  
S
S
S
G
D
D
q
JA  
T = 100°C  
A
16  
XXXXXX  
AYWZZ  
(Notes 1, 2, 3)  
Power Dissipation  
T = 25°C  
A
P
D
3.8  
1.9  
900  
W
R
(Notes 1, 2)  
q
JA  
T = 100°C  
A
D
Pulsed Drain Current  
T = 25°C, t = 10 ms  
A
I
DM  
A
p
XXXXXX = 6H801N  
XXXXXX = (NVMFS6H801N) or  
XXXXXX = 801NWF  
Operating Junction and Storage Temperature  
Range  
T , T  
55 to  
°C  
J
stg  
+175  
Source Current (Body Diode)  
I
S
138  
960  
A
XXXXXX = (NVMFS6H801NWF)  
A
Y
= Assembly Location  
= Year  
Single Pulse DraintoSource Avalanche  
E
AS  
mJ  
Energy (I  
= 12.2 A)  
L(pk)  
W
ZZ  
= Work Week  
= Lot Traceability  
Lead Temperature for Soldering Purposes  
(1/8from case for 10 s)  
T
L
260  
°C  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
ORDERING INFORMATION  
See detailed ordering, marking and shipping information in the  
package dimensions section on page 5 of this data sheet.  
THERMAL RESISTANCE MAXIMUM RATINGS  
Parameter  
Symbol  
Value  
0.9  
Unit  
JunctiontoCase Steady State  
JunctiontoAmbient Steady State (Note 2)  
R
°C/W  
q
JC  
R
39  
q
JA  
1. The entire application environment impacts the thermal resistance values shown,  
they are not constants and are only valid for the particular conditions noted.  
2
2. Surfacemounted on FR4 board using a 650 mm , 2 oz. Cu pad.  
3. Maximum current for pulses as long as 1 second is higher but is dependent  
on pulse duration and duty cycle.  
© Semiconductor Components Industries, LLC, 2016  
1
Publication Order Number:  
May, 2022 Rev. 4  
NVMFS6H801N/D  
 

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