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NVMFS6H800NWFT1G PDF预览

NVMFS6H800NWFT1G

更新时间: 2024-09-16 11:13:51
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
8页 224K
描述
Single N-Channel Power MOSFET 80V, 203A, 2.1mΩ

NVMFS6H800NWFT1G 数据手册

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DATA SHEET  
www.onsemi.com  
MOSFET - Power, Single  
N-Channel  
80 V, 2.1 mW, 203 A  
V
R
MAX  
I MAX  
D
(BR)DSS  
DS(ON)  
80 V  
2.1 mW @ 10 V  
203 A  
D (5,6)  
NVMFS6H800N  
Features  
Small Footprint (5x6 mm) for Compact Design  
G (4)  
Low R  
to Minimize Conduction Losses  
DS(on)  
Low Q and Capacitance to Minimize Driver Losses  
G
S (1,2,3)  
NCHANNEL MOSFET  
NVMFS6H800NWF Wettable Flank Option for Enhanced Optical  
Inspection  
AECQ101 Qualified and PPAP Capable  
These Devices are PbFree and are RoHS Compliant  
MARKING  
DIAGRAMS  
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
DFN5  
CASE 506EZ  
J
D
S
S
S
G
D
D
Parameter  
DraintoSource Voltage  
Symbol  
Value  
80  
Unit  
V
1
XXXXXX  
AYWZZ  
V
DSS  
DFNW5  
CASE 507BA  
GatetoSource Voltage  
V
GS  
20  
V
D
Continuous Drain  
Current R  
T
= 25°C  
= 100°C  
= 25°C  
I
203  
143  
200  
100  
28  
A
C
D
q
JC  
T
C
XXXXXX = Specific Device Code  
(Notes 1, 3)  
Steady  
State  
A
Y
W
ZZ  
= Assembly Location  
= Year  
= Work Week  
= Lot Traceability  
Power Dissipation  
T
C
P
W
A
D
R
(Note 1)  
q
JC  
T
C
= 100°C  
Continuous Drain  
Current R  
T = 25°C  
I
A
D
q
JA  
T = 100°C  
A
20  
(Notes 1, 2, 3)  
Steady  
State  
ORDERING INFORMATION  
See detailed ordering, marking and shipping information in the  
package dimensions section on page 5 of this data sheet.  
Power Dissipation  
T = 25°C  
A
P
3.8  
1.9  
900  
W
D
R
(Notes 1, 2)  
q
JA  
T = 100°C  
A
Pulsed Drain Current  
T = 25°C, t = 10 ms  
I
DM  
A
A
p
Operating Junction and Storage Temperature  
Range  
T , T  
55 to  
+175  
°C  
J
stg  
Source Current (Body Diode)  
I
S
166  
A
Single Pulse DraintoSource Avalanche  
E
AS  
1271  
mJ  
Energy (I  
= 16.1 A)  
L(pk)  
Lead Temperature for Soldering Purposes  
(1/8from case for 10 s)  
T
L
260  
°C  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
THERMAL RESISTANCE MAXIMUM RATINGS  
Parameter  
Symbol  
Value  
0.75  
39  
Unit  
JunctiontoCase Steady State  
JunctiontoAmbient Steady State (Note 2)  
R
°C/W  
q
JC  
R
q
JA  
1. The entire application environment impacts the thermal resistance values shown,  
they are not constants and are only valid for the particular conditions noted.  
2
2. Surfacemounted on FR4 board using a 650 mm , 2 oz. Cu pad.  
3. Maximum current for pulses as long as 1 second is higher but is dependent  
on pulse duration and duty cycle.  
© Semiconductor Components Industries, LLC, 2017  
1
Publication Order Number:  
August, 2022 Rev. 3  
NVMFS6H800N/D  
 

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