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NVMFS5833NT1G

更新时间: 2024-11-17 01:05:47
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
6页 77K
描述
Single N−Channel Power MOSFET

NVMFS5833NT1G 数据手册

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NVMFS5833N  
Power MOSFET  
40 V, 7.5 mW, 86 A, Single N−Channel,  
SO−8FL  
Features  
Low R  
DS(on)  
http://onsemi.com  
Low Capacitance  
Optimized Gate Charge  
AEC−Q101 Qualified and PPAP Capable  
NVMFS5833NWF − Wettable Franks Option for Enhanced Optical  
Inspection  
V
R
MAX  
I MAX  
D
(BR)DSS  
DS(ON)  
40 V  
7.5 mW @ 10 V  
86 A  
These Devices are Pb−Free and are RoHS Compliant  
D (5)  
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
J
Parameter  
Drain−to−Source Voltage  
Symbol  
Value  
40  
Unit  
V
V
DSS  
G (4)  
Gate−to−Source Voltage  
V
"20  
86  
V
GS  
Continuous Drain Cur-  
rent R  
T
= 25°C  
= 100°C  
= 25°C  
I
A
mb  
D
Y
J−mb  
S (1,2,3)  
N−CHANNEL MOSFET  
T
mb  
61  
112  
56  
(Notes 1, 2, 3 & 4)  
Steady  
State  
Power Dissipation  
T
mb  
P
W
A
D
R
(Notes 1, 2, 3)  
Y
J−mb  
T
mb  
= 100°C  
MARKING DIAGRAM  
D
Continuous Drain Cur-  
rent R  
T = 25°C  
I
16  
A
D
S
S
S
G
D
D
q
JA  
1
T = 100°C  
A
11  
(Notes 1, 3 & 4)  
Steady  
State  
5833xx  
AYWZZ  
SO−8 FLAT LEAD  
CASE 488AA  
STYLE 1  
Power Dissipation  
T = 25°C  
P
3.7  
1.8  
324  
W
A
D
R
(Notes 1 & 3)  
q
JA  
T = 100°C  
A
D
Pulsed Drain Current  
T = 25°C, t = 10 ms  
I
DM  
A
A
p
5833  
xx  
= Specific Device Code  
= N (NVMFS5833N) or  
= WF (NVMFS5833NWF)  
= Assembly Location  
= Year  
Operating Junction and Storage Temperature  
T , T  
J
55 to  
175  
°C  
stg  
A
Y
W
ZZ  
Source Current (Body Diode)  
I
86  
65  
A
S
Single Pulse Drain−to−Source Avalanche  
E
mJ  
= Work Week  
= Lot Traceability  
AS  
Energy (T = 25°C, I  
= 36 A, L = 0.1 mH)  
J
L(pk)  
Lead Temperature for Soldering Purposes  
(1/8from case for 10 s)  
T
L
260  
°C  
ORDERING INFORMATION  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
Device  
Package  
Shipping  
NVMFS5833NT1G  
SO−8FL  
1500 /  
(Pb−Free) Tape & Reel  
THERMAL RESISTANCE MAXIMUM RATINGS  
Parameter  
Symbol  
Value  
Unit  
NVMFS5833NT3G  
SO−8FL 5000 /  
(Pb−Free) Tape & Reel  
SO−8FL 1500 /  
Junction−to−Mounting Board (top) − Steady  
State (Notes 2, 3)  
R
1.3  
°C/W  
Y
J−mb  
NVMFS5833NWFT1G  
NVMFS5833NWFT3G  
(Pb−Free) Tape & Reel  
Junction−to−Ambient − Steady State (Note 3)  
R
41  
q
JA  
1. The entire application environment impacts the thermal resistance values shown,  
they are not constants and are only valid for the particular conditions noted.  
2. Psi (Y) is used as required per JESD51−12 for packages in which  
substantially less than 100% of the heat flows to single case surface.  
SO−8FL 5000 /  
(Pb−Free) Tape & Reel  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
2
3. Surface−mounted on FR4 board using a 650 mm , 2 oz. Cu pad.  
4. Continuous DC current rating. Maximum current for pulses as long as  
1 second are higher but are dependent on pulse duration and duty cycle/  
© Semiconductor Components Industries, LLC, 2014  
1
Publication Order Number:  
September, 2014 − Rev. 1  
NVMFS5833N/D  
 

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