NVMFS5833N
Power MOSFET
40 V, 7.5 mW, 86 A, Single N−Channel,
SO−8FL
Features
• Low R
DS(on)
http://onsemi.com
• Low Capacitance
• Optimized Gate Charge
• AEC−Q101 Qualified and PPAP Capable
• NVMFS5833NWF − Wettable Franks Option for Enhanced Optical
Inspection
V
R
MAX
I MAX
D
(BR)DSS
DS(ON)
40 V
7.5 mW @ 10 V
86 A
• These Devices are Pb−Free and are RoHS Compliant
D (5)
MAXIMUM RATINGS (T = 25°C unless otherwise noted)
J
Parameter
Drain−to−Source Voltage
Symbol
Value
40
Unit
V
V
DSS
G (4)
Gate−to−Source Voltage
V
"20
86
V
GS
Continuous Drain Cur-
rent R
T
= 25°C
= 100°C
= 25°C
I
A
mb
D
Y
J−mb
S (1,2,3)
N−CHANNEL MOSFET
T
mb
61
112
56
(Notes 1, 2, 3 & 4)
Steady
State
Power Dissipation
T
mb
P
W
A
D
R
(Notes 1, 2, 3)
Y
J−mb
T
mb
= 100°C
MARKING DIAGRAM
D
Continuous Drain Cur-
rent R
T = 25°C
I
16
A
D
S
S
S
G
D
D
q
JA
1
T = 100°C
A
11
(Notes 1, 3 & 4)
Steady
State
5833xx
AYWZZ
SO−8 FLAT LEAD
CASE 488AA
STYLE 1
Power Dissipation
T = 25°C
P
3.7
1.8
324
W
A
D
R
(Notes 1 & 3)
q
JA
T = 100°C
A
D
Pulsed Drain Current
T = 25°C, t = 10 ms
I
DM
A
A
p
5833
xx
= Specific Device Code
= N (NVMFS5833N) or
= WF (NVMFS5833NWF)
= Assembly Location
= Year
Operating Junction and Storage Temperature
T , T
J
−55 to
175
°C
stg
A
Y
W
ZZ
Source Current (Body Diode)
I
86
65
A
S
Single Pulse Drain−to−Source Avalanche
E
mJ
= Work Week
= Lot Traceability
AS
Energy (T = 25°C, I
= 36 A, L = 0.1 mH)
J
L(pk)
Lead Temperature for Soldering Purposes
(1/8″ from case for 10 s)
T
L
260
°C
ORDERING INFORMATION
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
†
Device
Package
Shipping
NVMFS5833NT1G
SO−8FL
1500 /
(Pb−Free) Tape & Reel
THERMAL RESISTANCE MAXIMUM RATINGS
Parameter
Symbol
Value
Unit
NVMFS5833NT3G
SO−8FL 5000 /
(Pb−Free) Tape & Reel
SO−8FL 1500 /
Junction−to−Mounting Board (top) − Steady
State (Notes 2, 3)
R
1.3
°C/W
Y
J−mb
NVMFS5833NWFT1G
NVMFS5833NWFT3G
(Pb−Free) Tape & Reel
Junction−to−Ambient − Steady State (Note 3)
R
41
q
JA
1. The entire application environment impacts the thermal resistance values shown,
they are not constants and are only valid for the particular conditions noted.
2. Psi (Y) is used as required per JESD51−12 for packages in which
substantially less than 100% of the heat flows to single case surface.
SO−8FL 5000 /
(Pb−Free) Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
2
3. Surface−mounted on FR4 board using a 650 mm , 2 oz. Cu pad.
4. Continuous DC current rating. Maximum current for pulses as long as
1 second are higher but are dependent on pulse duration and duty cycle/
© Semiconductor Components Industries, LLC, 2014
1
Publication Order Number:
September, 2014 − Rev. 1
NVMFS5833N/D