NUP4212UPMU
Quad Transient Voltage
Suppressor Array
ESD Protection Diodes with Ultra−Low
(0.7 pF) Capacitance
http://onsemi.com
The four−line voltage transient suppressor array is designed to protect
voltage−sensitive components that require ultra−low capacitance from
ESD and transient voltage events. This device features a common anode
design which can protect up to four independent high speed data lines
and 1 or 2 separate 15 V TVS lines in a single six−lead UDFN low
profile package.
D
D
D
D
V
1
V
2
1
2
3
4
Excellent clamping capability, low capacitance, low leakage, and fast
response time make these parts ideal for ESD protection on designs
where board space is at a premium. Because of its low capacitance, it is
suited for use in high frequency designs such as a USB 2.0 high speed.
This device can be configured as a dual port USB device.
MARKING
DIAGRAM
Features
• Low Capacitance Data Lines (0.7 pF Typical)
1
• Protects up to Four Data Lines Plus a V Pin
UDFN6 1.6 X 1.6
MU SUFFIX
CASE 517AP
CC
6
P2 MG
• UDFN Package, 1.6 x 1.6 mm
G
1
• Low Profile of 0.50 mm for Ultra Slim Design
P2
M
G
= Specific Device Code
= Date Code
= Pb−Free Package
• V , V Pin = 15 V Protection
1
2
• D , D , D , and D Pins = 5.2 V Minimum Protection
1
2
3
4
• ESD Rating: IEC61000−4−2: Level 4
(Note: Microdot may be in either location)
− Contact (14 kV)
• This is a Pb−Free Device
PIN CONNECTIONS
Typical Applications
• USB 2.0 High−Speed Interface
• Cell Phones
• MP3 Players
• SIM Card Protection
6
5
4
V
D
D
D
1
2
3
2
1
2
3
GND
V
1
4
D
MAXIMUM RATINGS (T = 25°C, unless otherwise specified)
J
Symbol
Rating
Value
−40 to 125
−55 to 150
260
Unit
°C
ORDERING INFORMATION
T
T
T
Operating Junction Temperature Range
Storage Temperature Range
J
°C
†
STG
L
Device
Package
Shipping
Lead Solder Temperature – Maximum
(10 seconds)
°C
NUP4212UPMUTAG UDFN6 3000/Tape & Reel
(Pb−Free)
ESD
IEC 61000−4−2 Contact
14000
V
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
See Application Note AND8308/D for further description of survivability specs.
© Semiconductor Components Industries, LLC, 2009
1
Publication Order Number:
August, 2009− Rev. 1
NUP4212UPMU/D