DATA SHEET
www.onsemi.com
MOSFET - Power, Single
N-Channel, SUPERFET) V,
FRFET), TDFN4
600 V, 61 mW, 41 A
V
R
MAX
I MAX
D
DSS
DS(ON)
600 V
61 mW @ 10 V
41 A
D
NTMT061N60S5F
Description
The SUPERFET V MOSFET FRFET series, optimized reverse
recovery performance of body diode, can remove additional component
and improve system reliability for soft switching applications such as
PSFB and LLC. The Power88 package which is an ultra−slim SMD
package offers excellent switching performance by providing kelvin
source configuration and lower parasitic source inductance.
Features
G
S1: Driver Source
S2: Power Source
S1 S2
POWER MOSFET
G
• 650 V @ T = 150°C / Typ. R
= 48.8 mW
J
DS(on)
S1
S2
• 100% Avalanche Tested / MSL1 Qualified
S2
• Kelvin Source Configuration and Low Parasitic Source Inductance
• Pb−Free, Halogen Free/BFR Free and are RoHS Compliant
Applications
• Computing / Display Power Supplies
TDFN4 8x8 2P
CASE 520AB
• Telecom / Server Power Supplies
• Lighting / Charger/ Adapter / Industrial Power Supplies
ABSOLUTE MAXIMUM RATINGS (T = 25°C, Unless otherwise noted)
MARKING DIAGRAM
J
Parameter
Drain−to−Source Voltage
Symbol
Value
600
30
Unit
V
V
DSS
V
GSS
NTMT061
N60S5F
Gate−to−Source Voltage
DC
V
AWLYWW
AC (f > 1 Hz)
30
Continuous Drain Current
T
= 25°C
= 100°C
= 25°C
= 25°C
= 25°C
I
41
A
C
D
NTMT061N60S5F = Specific Device Code
T
C
25
A
WL
Y
= Assembly Location
= Wafer Lot
= Year
Power Dissipation
T
C
T
C
T
C
P
255
146
146
W
A
D
Pulsed Drain Current (Note 1)
I
DM
WW
= Work Week
Pulsed Source Current
(Body Diode) (Note 1)
I
A
SM
Operating Junction and Storage Temperature T , T
−55 to
+150
°C
J
STG
Range
ORDERING INFORMATION
Source Current (Body Diode)
I
41
A
S
Device
Package
Shipping
3000 / Tape &
Reel
Single Pulse Avalanche
Energy
I = 6.7 A,
G
E
AS
376
mJ
L
NTMT061N60S5F
TDFN4
R
= 25 W
Avalanche Current
I
6.7
2.55
120
70
A
AS
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
Repetitive Avalanche Energy (Note 1)
MOSFET dv/dt
E
mJ
AR
dv/dt
V/ns
Peak Diode Recovery dv/dt (Note 2)
Lead Temperature for Soldering Purposes
(1/8″ from case for 10 seconds)
T
L
260
°C
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
1. Repetitive rating: pulse−width limited by maximum junction temperature.
2. I ≤ 20.5 A, di/dt ≤ 200 A/ms, V ≤ 400 V, starting T = 25°C.
SD
DD
J
© Semiconductor Components Industries, LLC, 2021
1
Publication Order Number:
October, 2022 − Rev. 2
NTMT061N60S5F/D