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NTMTS001N06CLTXG PDF预览

NTMTS001N06CLTXG

更新时间: 2023-09-03 20:39:29
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
7页 360K
描述
Single N-Channel Power MOSFET 60V, 328A, 0.81mΩ

NTMTS001N06CLTXG 数据手册

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NTMTS001N06CL  
Power MOSFET  
60 V, 0.81 mW, 398.2 A, Single NChannel  
Features  
Small Footprint (8x8 mm) for Compact Design  
Low R  
to Minimize Conduction Losses  
Low Q and Capacitance to Minimize Driver Losses  
DS(on)  
www.onsemi.com  
G
Power 88 Package, Industry Standard  
These Devices are PbFree, Halogen Free/BFR Free and are RoHS  
V
R
MAX  
I MAX  
D
(BR)DSS  
DS(ON)  
Compliant  
0.81 mW @ 10 V  
1.05 mW @ 4.5 V  
60 V  
398.2 A  
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
J
Parameter  
DraintoSource Voltage  
Symbol  
Value  
60  
Unit  
V
V
DSS  
D (58)  
GatetoSource Voltage  
V
GS  
20  
V
Continuous Drain  
Current R  
T
= 25°C  
= 100°C  
= 25°C  
I
398.2  
281.6  
244  
122  
56.9  
40.2  
5.0  
A
C
D
q
JC  
T
C
(Notes 1, 3)  
Steady  
State  
G (1)  
Power Dissipation  
T
C
P
W
A
D
R
(Note 1)  
q
JC  
T
C
= 100°C  
S (24)  
Continuous Drain  
Current R  
T = 25°C  
A
I
D
NCHANNEL MOSFET  
q
JA  
T = 100°C  
A
(Notes 1, 2, 3)  
Steady  
State  
Power Dissipation  
T = 25°C  
A
P
W
D
R
(Notes 1, 2)  
q
JA  
T = 100°C  
A
2.5  
Pulsed Drain Current  
T = 25°C, t = 10 ms  
I
DM  
900  
A
A
p
Operating Junction and Storage Temperature  
Range  
T , T  
55 to  
+175  
°C  
J
stg  
Source Current (Body Diode)  
I
203.4  
887  
A
S
POWER 88  
CASE 507AP  
Single Pulse DraintoSource Avalanche  
E
AS  
mJ  
Energy (I  
= 30 A)  
L(pk)  
Lead Temperature for Soldering Purposes  
(1/8from case for 10 s)  
T
L
260  
°C  
MARKING DIAGRAM  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
XXXXXXXX  
AWLYWW  
THERMAL RESISTANCE MAXIMUM RATINGS  
Parameter  
Symbol  
Value  
0.614  
30.1  
Unit  
JunctiontoCase Steady State  
JunctiontoAmbient Steady State (Note 2)  
R
°C/W  
q
JC  
XXX = Device Code  
R
q
JA  
(8 AN characters max)  
= Assembly Location  
WL = 2digit Wafer Lot Code  
= Year Code  
WW = Work Week Code  
1. The entire application environment impacts the thermal resistance values shown,  
they are not constants and are only valid for the particular conditions noted.  
A
2
2. Surfacemounted on FR4 board using a 650 mm , 2 oz. Cu pad.  
Y
3. Maximum current for pulses as long as 1 second is higher but is dependent  
on pulse duration and duty cycle.  
ORDERING INFORMATION  
See detailed ordering, marking and shipping information in the  
package dimensions section on page 5 of this data sheet.  
© Semiconductor Components Industries, LLC, 2017  
1
Publication Order Number:  
January, 2019 Rev. 1  
NTMTS001N06CL/D  
 

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