MOSFET - Power, Single
N-Channel, DFNW8
80 V, 1.56 mW, 287 A
NTMTS1D5N08MC
Features
www.onsemi.com
• Small Footprint (8x8 mm) for Compact Design
• Low R
to Minimize Conduction Losses
DS(on)
• Low Q and Capacitance to Minimize Driver Losses
G
V
R
MAX
I MAX
D
(BR)DSS
DS(ON)
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
1.56 mW @ 10 V
4.0 mW @ 6 V
Compliant
80 V
287 A
Typical Applications
• Power Tools, Battery Operated Vacuums
• UAV/Drones, Material Handling
• BMS/Storage, Home Automation
D (5−8)
MAXIMUM RATINGS (T = 25°C unless otherwise noted)
J
G (1)
Parameter
Drain−to−Source Voltage
Symbol
Value
80
Unit
V
V
DSS
S (2−4)
Gate−to−Source Voltage
V
GS
20
V
N−CHANNEL MOSFET
Continuous Drain
T
= 25°C
I
287
A
C
D
Current R
(Note 2)
q
JC
Steady
State
Power Dissipation
(Note 2)
P
250
33
W
A
D
R
q
JC
Continuous Drain
Current R
T = 25°C
A
I
D
q
JA
Steady
State
(Notes 1, 2)
Power Dissipation
P
3.3
W
D
R
(Notes 1, 2)
q
JA
DFNW8
CASE 507AP
Pulsed Drain Current
T
= 25°C, t = 10 ms
I
DM
3500
A
C
p
Operating Junction and Storage Temperature
Range
T , T
−55 to
+150
°C
J
stg
MARKING DIAGRAM
Single Pulse Drain−to−Source Avalanche
E
AS
1441
mJ
Energy (I
= 31 A, L = 3 mH)
L(pk)
Lead Temperature for Soldering Purposes
(1/8″ from case for 10 s)
T
L
260
°C
1D5N08MC
AWLYWW
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
THERMAL RESISTANCE MAXIMUM RATINGS
1D5N08MC = Device Code
= Assembly Location
WL = 2−digit Wafer Lot Code
= Year Code
WW = Work Week Code
Parameter
Symbol
Value
0.5
Unit
A
Junction−to−Case − Steady State (Note 2)
Junction−to−Ambient − Steady State (Note 2)
R
°C/W
q
JC
Y
R
38
q
JA
2
1. Surface−mounted on FR4 board using a 1 in pad size, 1 oz. Cu pad.
2. The entire application environment impacts the thermal resistance values shown,
they are not constants and are only valid for the particular conditions noted.
ORDERING INFORMATION
See detailed ordering, marking and shipping information in the
package dimensions section on page 5 of this data sheet.
© Semiconductor Components Industries, LLC, 2019
1
Publication Order Number:
June, 2020 − Rev. 1
NTMTS1D5N08MC/D