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NTMTSC1D6N10MCTXG PDF预览

NTMTSC1D6N10MCTXG

更新时间: 2024-10-01 11:11:47
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
7页 420K
描述
Single N-Channel Power MOSFET 100V, 367A, 1.7mΩ

NTMTSC1D6N10MCTXG 数据手册

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DATA SHEET  
www.onsemi.com  
MOSFET - Power, Single  
N-Channel  
100 V, 1.7 mW, 267 A  
V
R
MAX  
I MAX  
D
(BR)DSS  
DS(ON)  
100 V  
1.7 mW @ 10 V  
267 A  
D (58)  
NTMTSC1D6N10MC  
Features  
G (1)  
Small Footprint (8x8 mm) for Compact Design  
Low R  
to Minimize Conduction Losses  
DS(on)  
Low Q and Capacitance to Minimize Driver Losses  
S (24)  
G
New Power 88 Dual Cool Package  
NCHANNEL MOSFET  
These Devices are PbFree and are RoHS Compliant  
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
J
Parameter  
DraintoSource Voltage  
Symbol  
Value  
100  
20  
Unit  
V
V
DSS  
TDFNW8  
GatetoSource Voltage  
V
GS  
V
CASE 507AS  
Continuous Drain  
Current R  
T
= 25°C  
= 100°C  
= 25°C  
I
267  
189  
291  
145  
30  
A
C
D
q
JC  
T
C
(Notes 1, 3)  
Steady  
State  
MARKING DIAGRAM  
Power Dissipation  
T
C
P
W
A
D
R
(Note 1)  
q
JC  
T
C
= 100°C  
Continuous Drain  
Current R  
T = 25°C  
A
I
D
q
JA  
T = 100°C  
A
21  
(Notes 1, 2, 3)  
Steady  
State  
Power Dissipation  
T = 25°C  
A
P
3.9  
W
D
R
(Notes 1, 2)  
q
JA  
1D6N10M AWLYW  
T = 100°C  
A
1.9  
Pulsed Drain Current  
T = 25°C, t = 10 ms  
I
DM  
900  
A
A
p
1D6N10M = Specific Device Code  
= Assembly Location  
WL = Wafer Lot Code  
A
Operating Junction and Storage Temperature  
Range  
T , T  
55 to  
+175  
°C  
J
stg  
Y
W
= Year Code  
= Work Week Code  
Source Current (Body Diode)  
I
S
243  
A
Single Pulse DraintoSource Avalanche  
E
AS  
1550  
mJ  
Energy (I  
= 22.3 A)  
L(pk)  
Lead Temperature for Soldering Purposes  
T
260  
°C  
L
ORDERING INFORMATION  
See detailed ordering, marking and shipping information in the  
package dimensions section on page 5 of this data sheet.  
(1/8from case for 10 s)  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
THERMAL RESISTANCE MAXIMUM RATINGS  
Parameter  
Symbol  
Value  
0.5  
Unit  
JunctiontoCase Bottom Steady State  
JunctiontoCase Top Steady State  
JunctiontoAmbient Steady State (Note 2)  
R
°C/W  
q
JCB  
R
0.8  
q
JCT  
R
38  
q
JA  
1. The entire application environment impacts the thermal resistance values shown,  
they are not constants and are only valid for the particular conditions noted.  
2
2. Surfacemounted on FR4 board using a 650 mm , 2 oz. Cu pad.  
3. Maximum current for pulses as long as 1 second is higher but is dependent  
on pulse duration and duty cycle.  
© Semiconductor Components Industries, LLC, 2018  
1
Publication Order Number:  
November, 2022 Rev. 2  
NTMTSC1D6N10MC/D  
 

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