DATA SHEET
www.onsemi.com
MOSFET - Power, Single
N-Channel
100 V, 1.7 mW, 267 A
V
R
MAX
I MAX
D
(BR)DSS
DS(ON)
100 V
1.7 mW @ 10 V
267 A
D (5−8)
NTMTSC1D6N10MC
Features
G (1)
• Small Footprint (8x8 mm) for Compact Design
• Low R
to Minimize Conduction Losses
DS(on)
• Low Q and Capacitance to Minimize Driver Losses
S (2−4)
G
• New Power 88 Dual Cool Package
N−CHANNEL MOSFET
• These Devices are Pb−Free and are RoHS Compliant
MAXIMUM RATINGS (T = 25°C unless otherwise noted)
J
Parameter
Drain−to−Source Voltage
Symbol
Value
100
20
Unit
V
V
DSS
TDFNW8
Gate−to−Source Voltage
V
GS
V
CASE 507AS
Continuous Drain
Current R
T
= 25°C
= 100°C
= 25°C
I
267
189
291
145
30
A
C
D
q
JC
T
C
(Notes 1, 3)
Steady
State
MARKING DIAGRAM
Power Dissipation
T
C
P
W
A
D
R
(Note 1)
q
JC
T
C
= 100°C
Continuous Drain
Current R
T = 25°C
A
I
D
q
JA
T = 100°C
A
21
(Notes 1, 2, 3)
Steady
State
Power Dissipation
T = 25°C
A
P
3.9
W
D
R
(Notes 1, 2)
q
JA
1D6N10M AWLYW
T = 100°C
A
1.9
Pulsed Drain Current
T = 25°C, t = 10 ms
I
DM
900
A
A
p
1D6N10M = Specific Device Code
= Assembly Location
WL = Wafer Lot Code
A
Operating Junction and Storage Temperature
Range
T , T
−55 to
+175
°C
J
stg
Y
W
= Year Code
= Work Week Code
Source Current (Body Diode)
I
S
243
A
Single Pulse Drain−to−Source Avalanche
E
AS
1550
mJ
Energy (I
= 22.3 A)
L(pk)
Lead Temperature for Soldering Purposes
T
260
°C
L
ORDERING INFORMATION
See detailed ordering, marking and shipping information in the
package dimensions section on page 5 of this data sheet.
(1/8″ from case for 10 s)
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
THERMAL RESISTANCE MAXIMUM RATINGS
Parameter
Symbol
Value
0.5
Unit
Junction−to−Case − Bottom − Steady State
Junction−to−Case − Top − Steady State
Junction−to−Ambient − Steady State (Note 2)
R
°C/W
q
JCB
R
0.8
q
JCT
R
38
q
JA
1. The entire application environment impacts the thermal resistance values shown,
they are not constants and are only valid for the particular conditions noted.
2
2. Surface−mounted on FR4 board using a 650 mm , 2 oz. Cu pad.
3. Maximum current for pulses as long as 1 second is higher but is dependent
on pulse duration and duty cycle.
© Semiconductor Components Industries, LLC, 2018
1
Publication Order Number:
November, 2022 − Rev. 2
NTMTSC1D6N10MC/D