MOSFET - Power, Single
N-Channel
80 V, 1.5 mW, 255 A
NTMTS1D5N08H
Features
www.onsemi.com
• Small Footprint (8x8 mm) for Compact Design
• Low R
to Minimize Conduction Losses
DS(on)
• Low Q and Capacitance to Minimize Driver Losses
G
V
R
MAX
I MAX
D
(BR)DSS
DS(ON)
• These Devices are Pb−Free and are RoHS Compliant
80 V
1.5 mW @ 10 V
255 A
MAXIMUM RATINGS (T = 25°C unless otherwise noted)
J
Parameter
Drain−to−Source Voltage
Symbol
Value
80
Unit
V
D (5−8)
V
DSS
Gate−to−Source Voltage
V
GS
20
V
Continuous Drain
Current R
T
= 25°C
= 100°C
= 25°C
I
255
162
208
83
A
C
D
q
JC
G (1)
T
C
(Notes 1, 3)
Steady
State
Power Dissipation
T
C
P
W
A
D
R
(Note 1)
S (2−4)
q
JC
T
C
= 100°C
N−CHANNEL MOSFET
Continuous Drain
Current R
T = 25°C
A
I
D
36
q
JA
T = 100°C
A
23
(Notes 1, 2, 3)
Steady
State
Power Dissipation
T = 25°C
A
P
4.2
1.7
900
W
D
R
(Notes 1, 2)
q
JA
T = 100°C
A
Pulsed Drain Current
T = 25°C, t = 10 ms
I
DM
A
A
p
Operating Junction and Storage Temperature
Range
T , T
−55 to
+150
°C
J
stg
Source Current (Body Diode)
I
S
173
A
DFNW8
CASE 507AP
Single Pulse Drain−to−Source Avalanche
E
AS
1536
mJ
Energy (L = 3 mH, I
= 32 A)
L(pk)
Lead Temperature for Soldering Purposes
(1/8″ from case for 10 s)
T
L
260
°C
MARKING DIAGRAM
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
1D5N08H
AWLYWW
THERMAL RESISTANCE MAXIMUM RATINGS
Parameter
Symbol
Value
0.6
Unit
Junction−to−Case − Steady State
Junction−to−Ambient − Steady State (Note 2)
R
°C/W
q
JC
R
30
A
= Assembly Location
q
JA
WL = 2−digit Wafer Lot Code
= Year Code
WW = Work Week Code
1. The entire application environment impacts the thermal resistance values shown,
they are not constants and are only valid for the particular conditions noted.
Y
2
2. Surface−mounted on FR4 board using a 650 mm , 2 oz. Cu pad.
3. Maximum current for pulses as long as 1 second is higher but is dependent
on pulse duration and duty cycle.
ORDERING INFORMATION
See detailed ordering, marking and shipping information in the
package dimensions section on page 5 of this data sheet.
© Semiconductor Components Industries, LLC, 2019
1
Publication Order Number:
July, 2020 − Rev. 1
NTMTS1D5N08H/D