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NTMFS5C682NLT1G PDF预览

NTMFS5C682NLT1G

更新时间: 2024-11-03 01:11:03
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
6页 93K
描述
Power MOSFET

NTMFS5C682NLT1G 技术参数

是否无铅: 不含铅生命周期:Active
Reach Compliance Code:not_compliantFactory Lead Time:1 week
风险等级:1.54JESD-609代码:e3
峰值回流温度(摄氏度):NOT SPECIFIED端子面层:Tin (Sn)
处于峰值回流温度下的最长时间:NOT SPECIFIEDBase Number Matches:1

NTMFS5C682NLT1G 数据手册

 浏览型号NTMFS5C682NLT1G的Datasheet PDF文件第2页浏览型号NTMFS5C682NLT1G的Datasheet PDF文件第3页浏览型号NTMFS5C682NLT1G的Datasheet PDF文件第4页浏览型号NTMFS5C682NLT1G的Datasheet PDF文件第5页浏览型号NTMFS5C682NLT1G的Datasheet PDF文件第6页 
NTMFS5C682NL  
Power MOSFET  
60 V, 21 mW, 25 A, Single N−Channel  
Features  
Small Footprint (5x6 mm) for Compact Design  
Low R  
to Minimize Conduction Losses  
Low Q and Capacitance to Minimize Driver Losses  
DS(on)  
www.onsemi.com  
G
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS  
Compliant  
V
R
MAX  
I MAX  
D
(BR)DSS  
DS(ON)  
21 mW @ 10 V  
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
60 V  
25 A  
J
31.5 mW @ 4.5 V  
Parameter  
Drain−to−Source Voltage  
Symbol  
Value  
60  
Unit  
V
V
DSS  
Gate−to−Source Voltage  
V
GS  
20  
V
D (5)  
Continuous Drain  
Current R  
(Notes 1, 3)  
T
= 25°C  
I
25  
A
C
D
q
JC  
T
C
= 100°C  
18  
Steady  
State  
Power Dissipation  
T
C
= 25°C  
P
28  
14  
W
A
D
G (4)  
R
(Note 1)  
q
JC  
T
C
= 100°C  
Continuous Drain  
Current R  
T = 25°C  
A
I
D
8.8  
S (1,2,3)  
N−CHANNEL MOSFET  
q
JA  
T = 100°C  
A
6.2  
(Notes 1, 2, 3)  
Steady  
State  
Power Dissipation  
T = 25°C  
A
P
3.5  
1.7  
130  
W
D
R
(Notes 1 & 2)  
q
JA  
T = 100°C  
A
MARKING  
DIAGRAM  
Pulsed Drain Current  
T = 25°C, t = 10 ms  
I
DM  
A
A
p
D
Operating Junction and Storage Temperature  
T , T  
55 to  
+ 175  
°C  
J
stg  
1
S
S
S
G
D
D
DFN5  
(SO−8FL)  
CASE 488AA  
STYLE 1  
5C682L  
AYWZZ  
Source Current (Body Diode)  
I
S
31  
43  
A
Single Pulse Drain−to−Source Avalanche  
E
AS  
mJ  
Energy (I  
= 1.1 A)  
L(pk)  
D
Lead Temperature for Soldering Purposes  
(1/8from case for 10 s)  
T
260  
°C  
L
5C682L = Specific Device Code  
A
Y
= Assembly Location  
= Year  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
W
ZZ  
= Work Week  
= Lot Traceability  
THERMAL RESISTANCE MAXIMUM RATINGS  
Parameter  
Symbol  
Value  
Unit  
ORDERING INFORMATION  
See detailed ordering, marking and shipping information in the  
package dimensions section on page 5 of this data sheet.  
Junction−to−Case − Steady State  
R
5.3  
43  
°C/W  
q
q
JC  
Junction−to−Ambient − Steady State (Note 2)  
R
JA  
1. The entire application environment impacts the thermal resistance values shown,  
they are not constants and are only valid for the particular conditions noted.  
2
2. Surface−mounted on FR4 board using a 650 mm , 2 oz. Cu pad.  
3. Maximum current for pulses as long as 1 second is higher but is dependent  
on pulse duration and duty cycle.  
© Semiconductor Components Industries, LLC, 2017  
1
Publication Order Number:  
April, 2017 − Rev. 0  
NTMFS5C682NL/D  
 

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