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NTLJD2105L PDF预览

NTLJD2105L

更新时间: 2024-09-24 03:27:23
品牌 Logo 应用领域
安森美 - ONSEMI 开关高压
页数 文件大小 规格书
6页 101K
描述
POWER MOSFET 8 V, 4.3 A, uCool High Side Load Switch with Level Shift, 2x2 mm WDFN Package

NTLJD2105L 数据手册

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NTLJD2105L  
POWER MOSFET  
8 V, 4.3 A, mCool] High Side Load Switch  
with Level Shift, 2x2 mm WDFN Package  
Features  
WDFN 2x2 mm Package with Exposed Drain Pads Offers Excellent  
http://onsemi.com  
Thermal Performance  
Low R  
P−Channel Load Switch with N−channel MOSFET for  
DS(on)  
Level Shift  
V
R
MAX  
I MAX  
L
INMAX  
DS(on)  
50 mW @ 4.5 V  
60 mW @ 2.5 V  
N Channel Operated at 1.5 V Gate Drive Voltage Level  
P Channel Operated at 1.5 V Supply Voltage  
Same Footprint as SC88  
20 V  
4.3 A  
80 mW @ 1.8 V  
115 mW @ 1.5 V  
Low Profile (<0.8 mm) Allows it to Fit Easily into Extremely Thin  
Environments  
4
5
2, 3  
6
ESD Protection  
These are Pb−Free Devices  
Q2  
Applications  
High Slide Load Switch with Level Shift  
Optimized for Power Management in Ultra Portable Equipment  
Q1  
MOSFET(Q2) MAXIMUM RATINGS  
(T = 25°C unless otherwise stated)  
J
1
Parameter  
Q2 Input Voltage (V , P−Channel)  
Symbol  
Value  
8
Unit  
V
MARKING  
DIAGRAM  
V
DS  
IN  
Q1 On/Off Voltage (V , N−Channel)  
V
6
V
GS  
ON/OFF  
1
2
3
6
5
4
Continuous Load  
Current (Note 1)  
T = 25°C  
I
4.3  
3.1  
1.56  
A
Pin 1  
JN M  
G
A
L
Steady  
State  
T = 85°C  
A
WDFN6  
CASE 506AZ  
Power Dissipation  
(Note 1)  
Steady  
State  
T = 25°C  
A
P
W
A
D
JN = Specific Device Code  
M
= Date Code  
Continuous Load  
Current (Note 2)  
T = 25°C  
A
I
2.5  
1.8  
L
G
= Pb−Free Package  
T = 85°C  
A
Steady  
State  
Power Dissipation  
(Note 2)  
T = 25°C  
A
P
0.52  
W
A
D
PIN CONNECTIONS  
Pulsed Load  
Current  
t = 10 ms  
p
I
20  
LM  
Operating Junction and Storage  
Temperature  
T ,  
−55 to  
150  
°C  
J
S1  
D1/G2  
G1  
1
6
T
D1/G2  
STG  
Source Current (Body Diode) (Note 2)  
I
−2.7  
260  
A
S
D2  
D2  
2
5
4
Lead Temperature for Soldering Purposes  
(1/8” from case for 10 s)  
T
°C  
L
S2  
3
D2  
1. Surface−mounted on FR4 board using 1 in sq pad size (Cu area = 1.127 in sq  
[2 oz] including traces)  
2. Surface−mounted on FR4 board using the minimum recommended pad size.  
(Top View)  
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on page 5 of this data sheet.  
©
Semiconductor Components Industries, LLC, 2006  
1
Publication Order Number:  
November, 2006 − Rev. 0  
NTLJD2105L/D  
 

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